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MT58L64L36DT-6IT PDF预览

MT58L64L36DT-6IT

更新时间: 2024-11-10 06:21:39
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器
页数 文件大小 规格书
17页 308K
描述
Cache SRAM, 64KX36, 3.5ns, CMOS, PQFP100, PLASTIC, MS-026BHA, TQFP-100

MT58L64L36DT-6IT 数据手册

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2Mb: 128K x 18, 64K x 32/36  
PIPELINED, DCD SYNCBURST SRAM  
MT58L128L18D, MT58L64L32D,  
MT58L64L36D  
2Mb SYNCBURST™  
SRAM  
3.3V VDD, 3.3V I/O, Pipelined, Double-Cycle Deselect  
FEATURES  
• Fast clock and OE# access times  
100-Pin TQFP*  
• Single +3.3V +0.3V/-0.165V power supply (VDD)  
• Separate +3.3V isolated output buffer supply (VDDQ)  
• SNOOZE MODE for reduced-power standby  
• Common data inputs and data outputs  
• Individual BYTE WRITE control and GLOBAL WRITE  
• Three chip enables for simple depth expansion and  
address pipelining  
• Clock-controlled and registered addresses, data I/Os  
and control signals  
• Internally self-timed WRITE cycle  
• Burst control pin (interleaved or linear burst)  
• Automatic power-down for portable applications  
• 100-lead TQFP package for high density, high speed  
• Low capacitive bus loading  
• x18, x32 and x36 options available  
*JEDEC-standard MS-026 BHA (LQFP).  
OPTIONS  
MARKING  
• Timing (Access/Cycle/MHz)  
3.5ns/6ns/166 MHz  
4.0ns/7.5ns/133 MHz  
5ns/10ns/100 MHz  
synchronous inputs include all addresses, all data inputs,  
active LOW chip enable (CE#), two additional chip enables  
for easy depth expansion (CE2, CE2#), burst control inputs  
(ADSC#, ADSP#, ADV#), byte write enables (BWx#) and  
global write (GW#).  
Asynchronous inputs include the output enable (OE#),  
clock (CLK) and snooze enable (ZZ). There is also a burst  
mode pin (MODE) that selects between interleaved and  
linear burst modes. The data-out (Q), enabled by OE#, is  
also asynchronous. WRITE cycles can be from one to two  
bytes wide (x18) or from one to four bytes wide (x32/x36),  
as controlled by the write control inputs.  
Burstoperationcanbeinitiatedwitheitheraddressstatus  
processor (ADSP#) or address status controller (ADSC#)  
input pins. Subsequent burst addresses can be internally  
generated as controlled by the burst advance pin (ADV#).  
Address and write control are registered on-chip to  
simplifyWRITEcycles.Thisallowsself-timedWRITEcycles.  
Individualbyteenablesallowindividualbytestobewritten.  
During WRITE cycles on the x18 device, BWa# controls  
DQa pins and DQPa; BWb# controls DQb pins and DQPb.  
During WRITE cycles on the x32 and x36 devices, BWa#  
controls DQa pins and DQPa; BWb# controls DQb pins and  
DQPb; BWc# controls DQc pins and DQPc; BWd# controls  
DQd pins and DQPd. GW# LOW causes all bytes to be  
written. Parity pins are only available on the x18 and x36  
versions.  
-6  
-7.5  
-10  
• Configurations  
128K x 18  
MT58L128L18D  
MT58L64L32D  
MT58L64L36D  
64K x 32  
64K x 36  
• Package  
100-pin TQFP  
T
• Operating Temperature Range  
Commercial (0°C to +70°C)  
Industrial (-40°C to +85°C)  
None  
IT  
• Part Number Example: MT58L128L18DT-10 IT  
GENERAL DESCRIPTION  
®
The Micron SyncBurst SRAM family employs high-  
speed, low-power CMOS designs that are fabricated using  
an advanced CMOS process.  
Micron’s 2Mb SyncBurst SRAMs integrate a 128K x 18,  
64Kx32,or64Kx36SRAMcorewithadvancedsynchronous  
peripheral circuitry and a 2-bit burst counter. All  
synchronous inputs pass through registers controlled by a  
positive-edge-triggered single clock input (CLK). The  
2Mb: 128K x 18, 64K x 32/36 Pipelined, DCD SyncBurst SRAM  
MT58L128L18D.p65 – Rev. 9/99  
Micron Technology, Inc., reserves the right to change products or specifications without notice.  
1999, Micron Technology, Inc.  
All registered and unregistered trademarks are the sole property of their respective companies.  
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