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MT58L64L36DT-6 PDF预览

MT58L64L36DT-6

更新时间: 2024-11-08 04:27:39
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器
页数 文件大小 规格书
19页 414K
描述
Cache SRAM, 64KX36, 3.5ns, CMOS, PQFP100, PLASTIC, MS-026BHA, TQFP-100

MT58L64L36DT-6 数据手册

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2Mb: 128K x 18, 64K x 32/36  
PIPELINED, DCD SYNCBURST SRAM  
2Mb SYNCBURST™  
SRAM  
MT58L128L18D, MT58L64L32D,  
MT58L64L36D  
3.3V VDD, 3.3V I/O, Pipelined, Double-Cycle  
Deselect  
FEATURES  
• Fast clock and OE# access times  
• Single +3.3V +0.3V/-0.165V power supply (VDD)  
• Separate +3.3V isolated output buffer supply  
(VDDQ)  
100-PinTQFP**  
• SNOOZE MODE for reduced-power standby  
• Common data inputs and data outputs  
• Individual BYTE WRITE control and GLOBAL  
WRITE  
• Three chip enables for simple depth expansion and  
address pipelining  
• Clock-controlled and registered addresses, data  
I/Os and control signals  
• Internally self-timed WRITE cycle  
• Burst control pin (interleaved or linear burst)  
• Automatic power-down  
**JEDEC-standard MS-026 BHA (LQFP).  
• 100-pin TQFP package  
• Low capacitive bus loading  
• x18, x32, and x36 options available  
controlled by a positive-edge-triggered single clock  
input (CLK). The synchronous inputs include all ad-  
dresses, all data inputs, active LOW chip enable (CE#),  
two additional chip enables for easy depth expansion  
(CE2, CE2#), burst control inputs (ADSC#, ADSP#,  
ADV#), byte write enables (BWx#) and global write  
(GW#).  
Asynchronous inputs include the output enable  
(OE#), clock (CLK) and snooze enable (ZZ). There is also  
a burst mode pin (MODE) that selects between inter-  
leaved and linear burst modes. The data-out (Q), en-  
abled by OE#, is also asynchronous. WRITE cycles can  
be from one to two bytes wide (x18) or from one to four  
bytes wide (x32/x36), as controlled by the write control  
inputs.  
OPTIONS  
MARKING*  
• Timing (Access/Cycle/MHz)  
3.5ns/6ns/166 MHz  
4.0ns/7.5ns/133 MHz  
5ns/10ns/100 MHz  
-6  
-7.5  
-10  
• Configurations  
128K x 18  
MT58L128L18D  
MT58L64L32D  
MT58L64L36D  
64K x 32  
64K x 36  
• Packages  
100-pin TQFP  
T
• Operating Temperature Range  
Commercial (0°C to +70°C)  
None  
Burst operation can be initiated with either address  
status processor (ADSP#) or address status controller  
(ADSC#) input pins. Subsequent burst addresses can be  
internally generated as controlled by the burst advance  
pin (ADV#).  
Address and write control are registered on-chip to  
simplify WRITE cycles. This allows self-timed WRITE  
cycles. Individual byte enables allow individual bytes  
to be written. During WRITE cycles on the x18 device,  
BWa# controls DQa pins and DQPa; BWb# controls  
DQb pins and DQPb. During WRITE cycles on the x32  
and x36 devices, BWa# controls DQa pins and DQPa;  
BWb# controls DQb pins and DQPb; BWc# controls  
Part Number Example:  
MT58L128L18DT-10  
GENERALDESCRIPTION  
The Micron® SyncBurstSRAM family employs  
high- speed, low-power CMOS designs that are fabri-  
cated using an advanced CMOS process.  
Micron’s 2Mb SyncBurst SRAMs integrate a 128K x  
18, 64K x 32, or 64K x 36 SRAM core with advanced  
synchronous peripheral circuitry and a 2-bit burst  
counter. All synchronous inputs pass through registers  
2Mb: 128K x 18, 64K x 32/36 Pipelined, DCD SyncBurst SRAM  
MT58L128L18D_2.p65 – Rev. 6/01  
Micron Technology, Inc., reserves the right to change products or specifications without notice.  
1
©2000,MicronTechnology,Inc.  

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