2Mb: 128K x 18, 64K x 32/36
PIPELINED, DCD SYNCBURST SRAM
2Mb SYNCBURST™
SRAM
MT58L128L18D, MT58L64L32D,
MT58L64L36D
3.3V VDD, 3.3V I/O, Pipelined, Double-Cycle
Deselect
FEATURES
• Fast clock and OE# access times
• Single +3.3V +0.3V/-0.165V power supply (VDD)
• Separate +3.3V isolated output buffer supply
(VDDQ)
100-PinTQFP**
• SNOOZE MODE for reduced-power standby
• Common data inputs and data outputs
• Individual BYTE WRITE control and GLOBAL
WRITE
• Three chip enables for simple depth expansion and
address pipelining
• Clock-controlled and registered addresses, data
I/Os and control signals
• Internally self-timed WRITE cycle
• Burst control pin (interleaved or linear burst)
• Automatic power-down
**JEDEC-standard MS-026 BHA (LQFP).
• 100-pin TQFP package
• Low capacitive bus loading
• x18, x32, and x36 options available
controlled by a positive-edge-triggered single clock
input (CLK). The synchronous inputs include all ad-
dresses, all data inputs, active LOW chip enable (CE#),
two additional chip enables for easy depth expansion
(CE2, CE2#), burst control inputs (ADSC#, ADSP#,
ADV#), byte write enables (BWx#) and global write
(GW#).
Asynchronous inputs include the output enable
(OE#), clock (CLK) and snooze enable (ZZ). There is also
a burst mode pin (MODE) that selects between inter-
leaved and linear burst modes. The data-out (Q), en-
abled by OE#, is also asynchronous. WRITE cycles can
be from one to two bytes wide (x18) or from one to four
bytes wide (x32/x36), as controlled by the write control
inputs.
OPTIONS
MARKING*
• Timing (Access/Cycle/MHz)
3.5ns/6ns/166 MHz
4.0ns/7.5ns/133 MHz
5ns/10ns/100 MHz
-6
-7.5
-10
• Configurations
128K x 18
MT58L128L18D
MT58L64L32D
MT58L64L36D
64K x 32
64K x 36
• Packages
100-pin TQFP
T
• Operating Temperature Range
Commercial (0°C to +70°C)
None
Burst operation can be initiated with either address
status processor (ADSP#) or address status controller
(ADSC#) input pins. Subsequent burst addresses can be
internally generated as controlled by the burst advance
pin (ADV#).
Address and write control are registered on-chip to
simplify WRITE cycles. This allows self-timed WRITE
cycles. Individual byte enables allow individual bytes
to be written. During WRITE cycles on the x18 device,
BWa# controls DQa pins and DQPa; BWb# controls
DQb pins and DQPb. During WRITE cycles on the x32
and x36 devices, BWa# controls DQa pins and DQPa;
BWb# controls DQb pins and DQPb; BWc# controls
Part Number Example:
MT58L128L18DT-10
GENERALDESCRIPTION
The Micron® SyncBurst™ SRAM family employs
high- speed, low-power CMOS designs that are fabri-
cated using an advanced CMOS process.
Micron’s 2Mb SyncBurst SRAMs integrate a 128K x
18, 64K x 32, or 64K x 36 SRAM core with advanced
synchronous peripheral circuitry and a 2-bit burst
counter. All synchronous inputs pass through registers
2Mb: 128K x 18, 64K x 32/36 Pipelined, DCD SyncBurst SRAM
MT58L128L18D_2.p65 – Rev. 6/01
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1
©2000,MicronTechnology,Inc.