品牌 | Logo | 应用领域 |
镁光 - MICRON | / | |
页数 | 文件大小 | 规格书 |
132页 | 1301K | |
描述 | ||
This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics. |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MT44K16M36RB-107 | MICRON |
获取价格 |
This tech note describes considerations in thermal applications for Micron memory devices, | |
MT44K32M18 | MICRON |
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576Mb: x18, x36 RLDRAM 3 | |
MT44K32M18RB-107 | MICRON |
获取价格 |
This tech note describes considerations in thermal applications for Micron memory devices, | |
MT44K32M36RB-093E | MICRON |
获取价格 |
This tech note describes considerations in thermal applications for Micron memory devices, | |
MT44K32M36RB-107E | MICRON |
获取价格 |
This tech note describes considerations in thermal applications for Micron memory devices, | |
MT44K64M18RB-093E | MICRON |
获取价格 |
This tech note describes considerations in thermal applications for Micron memory devices, | |
MT44K64M18RB-107E | MICRON |
获取价格 |
This tech note describes considerations in thermal applications for Micron memory devices, | |
MT4516-101Y | BOURNS |
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Low Impedance Chip Ferrite Beads | |
MT4516-151Y | BOURNS |
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Low Impedance Chip Ferrite Beads | |
MT4516-800Y | BOURNS |
获取价格 |
Low Impedance Chip Ferrite Beads |