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MT42L16M32D1HE-18 AUT PDF预览

MT42L16M32D1HE-18 AUT

更新时间: 2024-11-18 15:19:03
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镁光 - MICRON /
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140页 12789K
描述
MT42L16M32D1

MT42L16M32D1HE-18 AUT 数据手册

 浏览型号MT42L16M32D1HE-18 AUT的Datasheet PDF文件第2页浏览型号MT42L16M32D1HE-18 AUT的Datasheet PDF文件第3页浏览型号MT42L16M32D1HE-18 AUT的Datasheet PDF文件第4页浏览型号MT42L16M32D1HE-18 AUT的Datasheet PDF文件第5页浏览型号MT42L16M32D1HE-18 AUT的Datasheet PDF文件第6页浏览型号MT42L16M32D1HE-18 AUT的Datasheet PDF文件第7页 
134b: x32 Automotive LPDDR2 SDRAM  
Features  
Automotive LPDDR2 SDRAM  
MT42L16M32D1  
Options  
Marking  
Features  
• Ultra low-voltage core and I/O power supplies  
– VDD2 = 1.14–1.30V  
– VDDCA/VDDQ = 1.14–1.30V  
– VDD1 = 1.70–1.95V  
• Clock frequency range  
– 533–10 MHz (data rate range: 1066–20 Mb/s/pin)  
• Four-bit prefetch DDR architecture  
• Eight internal banks for concurrent operation  
• Multiplexed, double data rate, command/address  
inputs; commands entered on every CK edge  
• Bidirectional/differential data strobe per byte of  
data (DQS/DQS#)  
• Programmable READ and WRITE latencies (RL/WL)  
• Programmable burst lengths: 4, 8, or 16  
• Per-bank refresh for concurrent operation  
• On-chip temperature sensor to control self refresh  
rate (SR not supported >105°C)  
• VDD2: 1.2V  
L
• Configuration  
– 4 Meg x 32 x 4 banks  
• Device type  
– LPDDR2-S4, 1 die in package  
• FBGA “green” package  
– 134-ball FBGA  
(10mm x 11.5mm)  
• Timing – cycle time  
– 1.875ns @ RL = 8  
• Special options  
16M32  
D1  
HE  
-18  
A
– Automotive grade (Package-level  
burn-in)  
• Operating temperature range1  
– From –40°C to +105°C  
– From –40°C to +125°C  
• Revision  
AT  
UT2  
E
• Partial-array self refresh (PASR)  
1. When TC >105°C, self refresh mode is not  
available.  
2. UT option use based on automotive usage  
model. Contact Micron sales representative  
with questions.  
Notes:  
• Deep power-down mode (DPD)  
• Selectable output drive strength (DS)  
• Clock stop capability  
• RoHS-compliant, “green” packaging  
• AEC-Q100  
Table 1: Key Timing Parameters  
Speed  
Grade  
Clock Rate  
(MHz)  
Data Rate  
(Mb/s/pin)  
RL  
WL  
-18  
533  
1066  
8
4
Table 2: S4 Configuration Addressing  
Architecture  
16 Meg x 32  
Die configuration  
Row addressing  
Column addressing  
Number of die  
4 Meg x 32 x 4 banks  
8K (A[12:0])  
512 (A[8:0])  
1
1
1
Die per rank  
Ranks per channel1  
1. A channel is a complete LPDRAM interface, including command/address and data pins.  
Note:  
CCM005-196791117-10296  
u07m_lpddr2_auto_at_ut.pdf - Rev. D 07/2020 EN  
Micron Technology, Inc. reserves the right to change products or specifications without notice.  
© 2020 Micron Technology, Inc. All rights reserved.  
1
Products and specifications discussed herein are subject to change by Micron without notice.  

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