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MT41J128M16HA-15ED PDF预览

MT41J128M16HA-15ED

更新时间: 2024-02-14 06:29:40
品牌 Logo 应用领域
镁光 - MICRON 动态存储器双倍数据速率
页数 文件大小 规格书
211页 2907K
描述
DDR3 SDRAM MT41J512M4 – 64 Meg x 4 x 8 Banks MT41J256M8 – 32 Meg x 8 x 8 Banks MT41J128M16 – 16 Meg x 16 x 8 Banks

MT41J128M16HA-15ED 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:BGA
包装说明:TFBGA, BGA96,9X16,32针数:96
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.32.00.36风险等级:5.59
访问模式:MULTI BANK PAGE BURST最长访问时间:0.255 ns
其他特性:AUTO/SELF REFRESH最大时钟频率 (fCLK):667 MHz
I/O 类型:COMMON交错的突发长度:8
JESD-30 代码:R-PBGA-B96JESD-609代码:e1
长度:14 mm内存密度:2147483648 bit
内存集成电路类型:DDR DRAM内存宽度:16
功能数量:1端口数量:1
端子数量:96字数:134217728 words
字数代码:128000000工作模式:SYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:128MX16输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:TFBGA
封装等效代码:BGA96,9X16,32封装形状:RECTANGULAR
封装形式:GRID ARRAY, THIN PROFILE, FINE PITCH峰值回流温度(摄氏度):260
电源:1.5 V认证状态:Not Qualified
刷新周期:8192座面最大高度:1.2 mm
自我刷新:YES连续突发长度:8
最大待机电流:0.012 A子类别:DRAMs
最大压摆率:0.425 mA最大供电电压 (Vsup):1.575 V
最小供电电压 (Vsup):1.425 V标称供电电压 (Vsup):1.5 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Silver/Copper (Sn/Ag/Cu)
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:30
宽度:9 mmBase Number Matches:1

MT41J128M16HA-15ED 数据手册

 浏览型号MT41J128M16HA-15ED的Datasheet PDF文件第2页浏览型号MT41J128M16HA-15ED的Datasheet PDF文件第3页浏览型号MT41J128M16HA-15ED的Datasheet PDF文件第4页浏览型号MT41J128M16HA-15ED的Datasheet PDF文件第5页浏览型号MT41J128M16HA-15ED的Datasheet PDF文件第6页浏览型号MT41J128M16HA-15ED的Datasheet PDF文件第7页 
2Gb: x4, x8, x16 DDR3 SDRAM  
Features  
DDR3 SDRAM  
MT41J512M4 – 64 Meg x 4 x 8 Banks  
MT41J256M8 – 32 Meg x 8 x 8 Banks  
MT41J128M16 – 16 Meg x 16 x 8 Banks  
Options1  
Marking  
Features  
• VDD = VDDQ = 1.5V ±±.±05V  
• 1.5V center-terminated push/pull I/O  
• Differential bidirectional data strobe  
• 8n-bit prefetch architecture  
• Differential clock inputs (CK, CK#)  
• 8 internal banks  
• Nominal and dynamic on-die termination (ODT)  
for data, strobe, and mask signals  
• Programmable CAS READ latency (CL)  
• Posted CAS additive latency (AL)  
• Programmable CAS WRITE latency (CWL) based on  
tCK  
• Fixed burst length (BL) of 8 and burst chop (BC) of 4  
(via the mode register set [MRS])  
• Selectable BC4 or BL8 on-the-fly (OTF)  
• Self refresh mode  
• Configuration  
– 512 Meg x 4  
– 256 Meg x 8  
– 128 Meg x 16  
512M4  
256M8  
128M16  
• FBGA package (Pb-free) – x4, x8  
– 08-ball (8mm x 1±.5mm) Rev. M, K  
– 08-ball (9mm x 11.5mm) Rev. D  
• FBGA package (Pb-free) – x16  
– 96-ball (9mm x 14mm) Rev. D  
– 96-ball (8mm x 14mm) Rev. K  
• Timing – cycle time  
– 938ps @ CL = 14 (DDR3-2133)  
– 1.±01ns @ CL = 13 (DDR3-1866)  
– 1.25ns @ CL = 11 (DDR3-16±±)  
– 1.5ns @ CL = 9 (DDR3-1333)  
– 1.80ns @ CL = 0 (DDR3-1±66)  
• Operating temperature  
DA  
HX  
HA  
JT  
-±93  
-1±0  
-125  
-15E  
-180E  
• TC of ±°C to 95°C  
– Commercial (±°C TC +95°C)  
– Industrial (–4±°C TC +95°C)  
• Revision  
None  
IT  
:D/:M/:K  
– 64ms, 8192 cycle refresh at ±°C to 85°C  
– 32ms, 8192 cycle refresh at 85°C to 95°C  
• Self refresh temperature (SRT)  
• Write leveling  
• Multipurpose register  
• Output driver calibration  
1. Not all options listed can be combined to  
define an offered product. Use the part  
Note:  
catalog search on http://www.micron.com  
for available offerings.  
Table 1: Key Timing Parameters  
Speed Grade  
-0931, 2, 3, 4  
-1071, 2, 3  
-1251, 2,  
Data Rate (MT/s)  
Target tRCD-tRP-CL  
tRCD (ns)  
13.09  
13.91  
13.75  
13.5  
tRP (ns)  
13.09  
13.91  
13.75  
13.5  
CL (ns)  
13.09  
13.91  
13.75  
13.5  
2133  
1866  
1600  
1333  
1066  
14-14-14  
13-13-13  
11-11-11  
9-9-9  
-15E1,  
-187E  
7-7-7  
13.1  
13.1  
13.1  
1. Backward compatible to 1066, CL = 7 (-187E).  
2. Backward compatible to 1333, CL = 9 (-15E).  
3. Backward compatible to 1600, CL = 11 (-125).  
4. Backward compatible to 1866, CL = 13 (-107).  
Notes:  
PDF: 09005aef826aaadc  
2Gb_DDR3_SDRAM.pdf - Rev. Q 04/13 EN  
Micron Technology, Inc. reserves the right to change products or specifications without notice.  
1
‹ 2006 Micron Technology, Inc. All rights reserved.  
Products and specifications discussed herein are subject to change by Micron without notice.  

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