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MT40A512M16JY-075EAIT PDF预览

MT40A512M16JY-075EAIT

更新时间: 2024-01-31 17:04:53
品牌 Logo 应用领域
镁光 - MICRON 动态存储器双倍数据速率
页数 文件大小 规格书
358页 11412K
描述
8Gb: x4, x8, x16 DDR4 SDRAM

MT40A512M16JY-075EAIT 数据手册

 浏览型号MT40A512M16JY-075EAIT的Datasheet PDF文件第2页浏览型号MT40A512M16JY-075EAIT的Datasheet PDF文件第3页浏览型号MT40A512M16JY-075EAIT的Datasheet PDF文件第4页浏览型号MT40A512M16JY-075EAIT的Datasheet PDF文件第5页浏览型号MT40A512M16JY-075EAIT的Datasheet PDF文件第6页浏览型号MT40A512M16JY-075EAIT的Datasheet PDF文件第7页 
8Gb: x8, x16 Automotive DDR4 SDRAM  
Features  
Automotive DDR4 SDRAM  
MT40A1G8  
MT40A512M16  
Options1  
Marking  
Features  
• VDD = VDDQ = 1.2V ±±60V  
• VPP = 2.5V –1250V/+2560V  
• On-die, internal, adjustable VREFDQ generation  
• 1.2V pseudo open-drain I/O  
• Refresh ti0e of 8192-cycle at TC te0perature range:  
– ±40s at –46°C to 85°C  
• Configuration  
– 1 Gig x 8  
– 512 Meg x 1±  
1G8  
512M1±  
• 78-ball FBGA package (Pb-free) – x8  
– 800 x 1200 – Rev. B  
• 9±-ball FBGA package (Pb-free) – x1±  
– 800 x 1400 – Rev. B  
• Ti0ing – cycle ti0e  
– 6.756ns @ CL = 18 (DDR4-2±±±)  
– 6.833ns @ CL = 1± (DDR4-2466)  
• Product certification  
– Auto0otive  
• Operating te0perature  
– Industrial (–46° ” TC ” 95°C)  
– Auto0otive (–46° ” TC ” 165°C)  
– Ultra-high (–46° ” TC ” 125°C)3  
– Revision  
WE  
JY  
– 320s at 85°C to 95°C  
– 1±0s at 95°C to 165°C  
– 80s at 165°C to 125°C  
-675E  
-683E  
• 1± internal banks (x4, x8): 4 groups of 4 banks each  
• 8 internal banks (x1±): 2 groups of 4 banks each  
• 8n-bit prefetch architecture  
• Progra00able data strobe prea0bles  
• Data strobe prea0ble training  
• Co00and/Address latency (CAL)  
• Multipurpose register read and write capability  
• Write and read leveling  
A
IT  
AT  
UT  
:B  
• Self refresh 0ode  
1. Not all options listed can be combined to  
define an offered product. Use the part  
catalog search on http://www.micron.com  
for available offerings.  
Notes:  
• Low-power auto self refresh (LPASR)  
Te0perature controlled refresh (TCR)  
• Fine granularity refresh  
• Self refresh abort  
• Maxi0u0 power saving  
• Output driver calibration  
2. The data sheet does not support ×4 mode  
even though ×4 mode description exists in  
the following sections.  
3. The UT option use based on automotive us-  
age model. Please contact Micron sales rep-  
resentative if you have questions.  
• No0inal, park, and dyna0ic on-die ter0ination  
(ODT)  
• Data bus inversion (DBI) for data bus  
• Co00and/Address (CA) parity  
• Databus write cyclic redundancy check (CRC)  
• Per-DRAM addressability  
• Connectivity test (x1±)  
• JEDEC JESD-79-4 co0pliant  
• sPPR and hPPR capability  
• AEC-Q166  
• PPAP sub0ission  
• 8D response ti0e  
CCMTD-1406124318-10419  
8gb_auto_ddr4_dram.pdf - Rev. C 3/17 EN  
Micron Technology, Inc. reserves the right to change products or specifications without notice.  
© 2016 Micron Technology, Inc. All rights reserved.  
1
Products and specifications discussed herein are subject to change by Micron without notice.  

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8Gb: x4, x8, x16 DDR4 SDRAM