16Gb: x16 TwinDie Single Rank DDR4 SDRAM
Description
TwinDie™ 1.2V DDR4 SDRAM
MT40A1G16 – 64 Meg x 16 x 16 Banks x 1 Ranks
Options
• Configuration
Marking
Description
The 16Gb (TwinDie™) DDR4 SDRAM uses
Micron’s 8Gb DDR4 SDRAM die; two x8s combined to
make one x16. Similar signals as mono x16, there is
one extra ZQ connection for faster ZQ Calibration and
a BG1 control required for x8 addressing. Refer to Mi-
cron’s 8Gb DDR4 SDRAM data sheet (x8 option) for
the specifications not included in this document.
Specifications for base part number MT40A1G8 corre-
late to TwinDie manufacturing part number
MT40A1G16.
– 64 Meg x 16 x 16 banks x 1 rank
• 96-ball FBGA package (Pb-free)
– 9.5mm x 14mm x 1.2mm Die Rev :A
– 8.0mm x 14mm x 1.2mm Die Rev :B,
D
1G16
HBA
WBU
– 7.5mm x 13.5mm x 1.2mm Die
Rev :H
KNR
• Timing – cycle time1
– 0.682ns @ CL = 20 (DDR4-2933)
– 0.682ns @ CL = 21 (DDR4-2933)
– 0.750ns @ CL = 18 (DDR4-2666)
– 0.750ns @ CL = 19 (DDR4-2666)
– 0.833ns @ CL = 16 (DDR4-2400)
– 0.833ns @ CL = 17 (DDR4-2400)
– 0.937ns @ CL = 15 (DDR4-2133)
– 0.937ns @ CL = 16 (DDR4-2133)
– 1.071ns @ CL = 13 (DDR4-1866)
• Self refresh
-068E
-068
-075E
-075
-083E
-083
-093E
-093
Features
• Uses two x8 8Gb Micron die to make one x16
• Single rank TwinDie
• VDD = VDDQ = 1.2V (1.14–1.26V)
• 1.2V VDDQ-terminated I/O
• JEDEC-standard ball-out
• Low-profile package
• TC of 0°C to 95°C
– 0°C to 85°C: 8192 refresh cycles in 64ms
– 85°C to 95°C: 8192 refresh cycles in 32ms
-107E
– Standard
None
• Operating temperature
– Commercial (0°C ≤ TC ≤ 95°C)
• Revision
None
:A
:B, D
:H
1. CL = CAS (READ) latency.
Note:
Table 1: Key Timing Parameters
Speed Grade
-068E1
-0681
Data Rate (MT/s)
Target tRCD-tRP-CL
tRCD (ns)
13.64
14.32
13.5
tRP (ns)
13.64
14.32
13.5
CL (ns)
13.64
14.32
13.5
2933
2933
2666
2666
2400
2400
2133
2133
1866
20-20-20
21-21-21
18-18-18
19-19-19
16-16-16
17-17-17
15-15-15
16-16-16
13-13-13
-075E2
-0752
-083E3
-0833
-093E4
-0934
-107E5
14.25
13.32
14.16
14.06
15
14.25
13.32
14.16
14.06
15
14.25
13.32
14.16
14.06
15
13.92
13.92
13.92
1. Backward compatible to 1600, CL = 11; 1866, CL = 13; 2133, CL = 15; 2400, CL = 17; and 2666, CL = 19.
2. Backward compatible to 1600, CL = 11; 1866, CL = 13; 2133, CL = 15; and 2400, CL = 17.
Notes:
09005aef86573aa8
DDR4_16Gb_x16_1CS_TwinDie.pdf - Rev. E 12/16 EN
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1
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Products and specifications discussed herein are subject to change by Micron without notice.