品牌 | Logo | 应用领域 |
镁光 - MICRON | ![]() |
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页数 | 文件大小 | 规格书 |
132页 | 1301K | ![]() |
描述 | ||
This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics. |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MT29F8G08ABACAH4-ITS | MICRON |
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This tech note describes considerations in thermal applications for Micron memory devices, |
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MT29F8G08ABACAM71M3WC1 | MICRON |
获取价格 |
This tech note describes considerations in thermal applications for Micron memory devices, |
![]() |
MT29F8G08ABACAWP | MICRON |
获取价格 |
This tech note describes considerations in thermal applications for Micron memory devices, |
![]() |
MT29F8G08ABACAWP-IT | MICRON |
获取价格 |
This tech note describes considerations in thermal applications for Micron memory devices, |
![]() |
MT29F8G08ABBCAH4-IT | MICRON |
获取价格 |
This tech note describes considerations in thermal applications for Micron memory devices, |
![]() |
MT29F8G08ABBCAM71M3WC1 | MICRON |
获取价格 |
This tech note describes considerations in thermal applications for Micron memory devices, |
![]() |
MT29F8G08ADADAH4 | MICRON |
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4Gb, 8Gb, 16Gb: x8, x16 NAND Flash Memory Features |
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MT29F8G08ADADAH4D | MICRON |
获取价格 |
4Gb, 8Gb, 16Gb: x8, x16 NAND Flash Memory Features |
![]() |
MT29F8G08ADADAH4-IT | MICRON |
获取价格 |
This tech note describes considerations in thermal applications for Micron memory devices, |
![]() |
MT29F8G08ADAFAH4-AAT | MICRON |
获取价格 |
This tech note describes considerations in thermal applications for Micron memory devices, |
![]() |