品牌 | Logo | 应用领域 |
镁光 - MICRON | / | |
页数 | 文件大小 | 规格书 |
132页 | 1301K | |
描述 | ||
This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics. |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MT29F64G08AECABH1-10Z | MICRON |
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This tech note describes considerations in thermal applications for Micron memory devices, | |
MT29F64G08AECDBJ4-6 | MICRON |
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This tech note describes considerations in thermal applications for Micron memory devices, | |
MT29F64G08AFAAAWP-ITZ | MICRON |
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This tech note describes considerations in thermal applications for Micron memory devices, | |
MT29F64G08AJABAWP-IT | MICRON |
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This tech note describes considerations in thermal applications for Micron memory devices, | |
MT29F64G08CBABAL84A3WC1 | MICRON |
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Anticipating electrostatic discharge (ESD) technology roadmap trends with ESD control hard | |
MT29F64G08CBABBWP-12IT | MICRON |
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Anticipating electrostatic discharge (ESD) technology roadmap trends with ESD control hard | |
MT29F64G08CBEBBL84A3WC1 | MICRON |
获取价格 |
Anticipating electrostatic discharge (ESD) technology roadmap trends with ESD control hard | |
MT29F8G01ADAFD12-AAT | MICRON |
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This tech note describes considerations in thermal applications for Micron memory devices, | |
MT29F8G01ADAFD12-IT | MICRON |
获取价格 |
This tech note describes considerations in thermal applications for Micron memory devices, | |
MT29F8G01ADBFD12-AAT | MICRON |
获取价格 |
This tech note describes considerations in thermal applications for Micron memory devices, |