品牌 | Logo | 应用领域 |
镁光 - MICRON | / | |
页数 | 文件大小 | 规格书 |
132页 | 1301K | |
描述 | ||
This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics. |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MT29F4G08ABBDAM60A3WC1 | MICRON |
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This tech note describes considerations in thermal applications for Micron memory devices, | |
MT29F4G08ABBEAH4 | MICRON |
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This tech note describes considerations in thermal applications for Micron memory devices, | |
MT29F4G08ABBEAH4-IT | MICRON |
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This tech note describes considerations in thermal applications for Micron memory devices, | |
MT29F4G08ABBFAH4-AAT | MICRON |
获取价格 |
This tech note describes considerations in thermal applications for Micron memory devices, | |
MT29F4G08ABBFAH4-AIT | MICRON |
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This tech note describes considerations in thermal applications for Micron memory devices, | |
MT29F4G08ABBFAH4-AITES | MICRON |
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This tech note describes considerations in thermal applications for Micron memory devices, | |
MT29F4G08ABBFAH4-IT | MICRON |
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This tech note describes considerations in thermal applications for Micron memory devices, | |
MT29F4G08ABBFAM70A3WC1 | MICRON |
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This tech note describes considerations in thermal applications for Micron memory devices, | |
MT29F4G16ABADAH4 | MICRON |
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4Gb, 8Gb, 16Gb: x8, x16 NAND Flash Memory Features | |
MT29F4G16ABADAH4-AIT | MICRON |
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This tech note describes considerations in thermal applications for Micron memory devices, |