品牌 | Logo | 应用领域 |
镁光 - MICRON | ![]() |
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页数 | 文件大小 | 规格书 |
132页 | 1301K | ![]() |
描述 | ||
This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics. |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MT29F32G08AFABAWP-IT | MICRON |
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This tech note describes considerations in thermal applications for Micron memory devices, |
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MT29F32G08AFACAWP-Z | MICRON |
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This tech note describes considerations in thermal applications for Micron memory devices, |
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MT29F32G08CBACA | MICRON |
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Micron Confidential and Proprietary |
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MT29F32G08CBACAWP-Z | MICRON |
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Anticipating electrostatic discharge (ESD) technology roadmap trends with ESD control hard |
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MT29F32G08CBADAL83A3WC1 | MICRON |
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Anticipating electrostatic discharge (ESD) technology roadmap trends with ESD control hard |
![]() |
MT29F32G08CBEDBL83A3WC1 | MICRON |
获取价格 |
Anticipating electrostatic discharge (ESD) technology roadmap trends with ESD control hard |
![]() |
MT29F4G01AAADDHC-ITX | MICRON |
获取价格 |
This tech note describes considerations in thermal applications for Micron memory devices, |
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MT29F4G01ABAFD12-AAT | MICRON |
获取价格 |
This tech note describes considerations in thermal applications for Micron memory devices, |
![]() |
MT29F4G01ABAFD12-AUT | MICRON |
获取价格 |
This tech note describes considerations in thermal applications for Micron memory devices, |
![]() |
MT29F4G01ABAFD12-IT | MICRON |
获取价格 |
This tech note describes considerations in thermal applications for Micron memory devices, |
![]() |