品牌 | Logo | 应用领域 |
镁光 - MICRON | / | |
页数 | 文件大小 | 规格书 |
132页 | 1301K | |
描述 | ||
This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics. |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MT29F1G08ABAEAH4-AATX | MICRON |
获取价格 |
This tech note describes considerations in thermal applications for Micron memory devices, | |
MT29F1G08ABAEAH4-AITX | MICRON |
获取价格 |
This tech note describes considerations in thermal applications for Micron memory devices, | |
MT29F1G08ABAEAH4-ITX | MICRON |
获取价格 |
This tech note describes considerations in thermal applications for Micron memory devices, | |
MT29F1G08ABAEAM68M3WC1 | MICRON |
获取价格 |
This tech note describes considerations in thermal applications for Micron memory devices, | |
MT29F1G08ABAEAWP | MICRON |
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SLC NAND Flash | |
MT29F1G08ABAEAWP-AATX | MICRON |
获取价格 |
This tech note describes considerations in thermal applications for Micron memory devices, | |
MT29F1G08ABAEAWP-AITX | MICRON |
获取价格 |
This tech note describes considerations in thermal applications for Micron memory devices, | |
MT29F1G08ABAEAWP-IT | MICRON |
获取价格 |
This tech note describes considerations in thermal applications for Micron memory devices, | |
MT29F1G08ABAEAWP-ITX | MICRON |
获取价格 |
This tech note describes considerations in thermal applications for Micron memory devices, | |
MT29F1G08ABAFAH4-AAT | MICRON |
获取价格 |
This tech note describes considerations in thermal applications for Micron memory devices, |