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MT16VDDF6464(L)HG-335 PDF预览

MT16VDDF6464(L)HG-335

更新时间: 2024-11-07 01:03:31
品牌 Logo 应用领域
镁光 - MICRON 动态存储器双倍数据速率
页数 文件大小 规格书
15页 654K
描述
DDR SDRAM SODIMM

MT16VDDF6464(L)HG-335 数据手册

 浏览型号MT16VDDF6464(L)HG-335的Datasheet PDF文件第2页浏览型号MT16VDDF6464(L)HG-335的Datasheet PDF文件第3页浏览型号MT16VDDF6464(L)HG-335的Datasheet PDF文件第4页浏览型号MT16VDDF6464(L)HG-335的Datasheet PDF文件第5页浏览型号MT16VDDF6464(L)HG-335的Datasheet PDF文件第6页浏览型号MT16VDDF6464(L)HG-335的Datasheet PDF文件第7页 
512MB, 1GB (x64, DR) 200-Pin DDR SODIMM  
Fe a t u re s  
DDR SDRAM SODIMM  
MT16VDDF6464H – 512MB  
MT16VDDF12864H – 1GB  
For component data sheets, refer to Microns Web site: www.micron.com  
Fig u re 2:  
1GB 200-Pin SODIMM (MO-244)  
Fe a t u re s  
• 200-pin, small-outline dual in-line memory module  
PCB height: 31.75mm (1.25in)  
(SODIMM)  
• Fast data transfer rates: PC2100, PC2700, and PC3200  
• 512MB (64 Meg x 64) and 1GB (128 Meg x 64)  
• VDD = VDDQ = +2.5V  
(-40B: VDD = VDDQ = +2.6V)  
• VDDSPD = +2.3V to +3.6V  
• 2.5V I/ O (SSTL_2-compatible)  
• Internal, pipelined double data rate (DDR)  
2n-prefetch architecture; two data accesses per clock  
cycle  
• Bidirectional data strobe (DQS) transmitted/ received  
with data—that is, source-synchronous data capture  
• Differential clock inputs CK and CK#  
• Multiple internal device banks for concurrent  
operation  
• Dual rank  
• Programmable burst lengths (BL): 2, 4, or 8  
Auto precharge option  
Auto refresh and self refresh modes: 7.8125µs  
maximum average periodic refresh interval  
• Serial presence-detect (SPD) with EEPROM  
• Selectable CAS latency (CL) for maximum  
compatibility  
Op t io n s  
• Self refresh current  
Standard  
Low power  
• Operating temperature  
Commercial (0°C T +70°C)  
Industrial (–40°C T +85°C)  
• Package  
200-pin DIMM (standard)  
200-pin DIMM (Pb-free)  
• Memory clock, speed, CAS latency  
5.0ns (200 MHz), 400 MT/ s, CL = 3  
6.0ns (167 MHz), 333 MT/ s, CL = 2.5  
7.5ns (133 MHz), 266 MT/ s, CL = 2.5  
Ma rkin g  
None  
L
1
None  
I
A
A
G
Y
2
• Gold edge contacts  
-40B  
-335  
-265  
200-Pin SODIMM Fig u re s  
2
Notes: 1. See Table 9 on page 10 , Table 10 on page 11,  
or Table 11 on page 12 for low power values.  
Fig u re 1:  
512MB 200-Pin SODIMM (MO-244)  
PCB height: 31.75mm (1.25in)  
2. Contact Micron for product availability.  
PDF: 09005aef80a77a90/Source: 09005aef80a646bc  
DDF16C64_128x64_L_H.fm - Rev. G 8/08 EN  
Micron Technology, Inc., reserves the right to change products or specifications without notice.  
©2003 Micron Technology, Inc. All rights reserved.  
1
Products and specifications discussed herein are subject to change by Micron without notice.  

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