4GB, 8GB (x64, DR) 204-Pin 1.35V DDR3L SODIMM
Features
1.35V DDR3L SDRAM SODIMM
MT16KTF51264HZ – 4GB
MT16KTF1G64HZ – 8GB
Figure 1: 204-Pin SODIMM (R/C-F, R/C-F3)
Features
• DDR3L functionality and operations supported as
defined in the component data sheet
Module height: 30mm (1.181in)
• 204-pin, small outline dual in-line memory module
(SODIMM)
• Fast data transfer rates: PC3-14900, PC3-12800, or
PC3-10600
• 4GB (512 Meg x 64), 8GB (1 Gig x 64)
• VDD = 1.35V (1.283V–1.45V)
• VDD = 1.5V (1.425–1.575V)
• Backward compatible to VDD = 1.5V ±0.075V
• VDDSPD = 3.0–3.6V
Options
Marking
• Nominal and dynamic on-die termination (ODT) for
data, strobe, and mask signals
• Operating temperature
– Commercial (0°C ≤ TA ≤ +70°C)
• Package
None
Z
• Dual rank
• Fixed burst chop (BC) of 4 and burst length (BL) of 8
via the mode register set (MRS)
• On-board I2C serial presence-detect (SPD) EEPROM
• Selectable BC4 or BL8 on-the-fly (OTF)
• Gold edge contacts
– 204-pin DIMM (halogen-free)
• Frequency/CAS latency
– 1.07ns @ CL = 13 (DDR3-1866)
– 1.25ns @ CL = 11 (DDR3-1600)
– 1.5ns @ CL = 9 (DDR3-1333)
-1G9
-1G6
-1G4
• Halogen-free
• Fly-by topology
• Terminated control, command, and address bus
Table 1: Key Timing Parameters
Data Rate (MT/s)
Speed
Grade Nomenclature
Industry
CL =
13
CL =
11
CL =
10
tRCD
(ns)
tRP
(ns)
tRC
(ns)
CL = 9 CL = 8 CL = 7 CL = 6 CL = 5
-1G9
-1G6
-1G4
-1G1
-1G0
-80B
PC3-14900
PC3-12800
PC3-10600
PC3-8500
PC3-8500
PC3-6400
1866
1600
1333
1333
1333
–
1333
1333
1333
–
1066
1066
1066
1066
1066
–
1066
1066
1066
1066
–
800
800
800
800
800
800
667
667
667
667
667
667
13.125 13.125 47.125
13.125 13.125 48.125
13.125 13.125 49.125
13.125 13.125 50.625
–
–
–
–
–
1600
–
–
–
–
–
–
15
15
15
15
52.5
52.5
–
–
–
PDF: 09005aef846206a0
ktf16c512_1gx64hz.pdf - Rev. L 05/2021 EN
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1
© 2011 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.