Datasheet > MSOP

MSOP

更新时间： 2024-11-15 03:48:15

品牌	Logo	应用领域
STATSCHIP		/
页数	文件大小	规格书
2页	102K
描述
Small Outline Packages

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中文翻译

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数据手册

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MSOP 数据手册

TSSOPand MSOP

Small Outline Packages

• Wide range of body sizes

• 8 to 56 lead counts

• Thermally enhanced versions

available (TSSOP-ep and

MSOP-ep)

FEATURES

DESCRIPTION

STATS ChipPAC offers a complete line of Small Outline

TSSOP

Package (SOP) families including TSSOP, TSSOP-ep, and MSOP.

STATS ChipPAC’s TSSOP (Thin Shrink Small Outline Package) is

suitable for applications requiring a thin profile. TSSOP is a

leadframe based, plastic encapsulated package with gull wing

shaped leads on two sides with lead count ranging from 8 to

56 leads. The ultra thin TSSOP is made possible by optimal wire

looping control during the wire bonding process as well as

optimal package warpage control during the molding process.

TSSOP is designed to fill the niche of low pin count devices

where low profile and small footprint are key design consider-

ations. The TSSOP features 0.5 and 0.65mm lead pitch, and is

ideal for low pin count analog and mixed signal devices in

handheld applications such as PDAs and mobile / cellular

phones.

Taking the reliability of Small Outline Packages (SOP) one

step further, STATS ChipPAC offers a Micro Small Outline

Package (MSOP) for applications requiring thin, small, and

high reliability. This smaller package offers a smaller footprint,

shorter wires for improved electrical connections, and better

moisture reliability (MRT/MSL).

• Body Size: 3.0 x 4.4mm to 14.0 x 6.1mm

• Lead Count: 8L to 56L

• Lead Pitch: 0.50mm & 0.65mm

• Package Height: 1.20mm max.

• JEDEC standard compliant (MO-153)

• Lead-free (Pb-free) and Green

• Thermal Enhancements: ep (exposed pad)

MSOP

• Body Size: 3 x 3mm

• Lead Count: 8L & 10L

• Lead Pitch: 0.65mm (8L) and 0.50mm (10L)

• JEDEC standard compliant

• Lead-free (Pb-free) and Green

• Thermal enhancements: ep (exposed pad)

APPLICATIONS

• Analog and Operation Amplifiers

• Controllers and Drivers

In addition to standard TSSOP and MSOP, STATS ChipPAC

offers thermally enhanced “ep” versions featuring an exposed

die paddle for efficient heat dissipation. The exposed die

attach pad design of the TSSOP package can provide excellent

thermal dissipation by soldering the copper die attach pad

directly onto the PCB, and is ideal for low pin count analog and

mixed signal devices.

• Logic, Memory, and RF/Wireless

• Disk drives, video/audio and consumer electronics/

appliances

STATS ChipPAC uses the latest leadframe technology and

state of the art design and simulation tools to achieve

optimum electrical and thermal performance. STATS ChipPAC’s

state of the art assembly facility and proven materials assure

high yield manufacturing and long term reliability.

www.statschippac.com

中文翻译

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