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MSM81000BI-020/48D PDF预览

MSM81000BI-020/48D

更新时间: 2024-02-01 09:29:28
品牌 Logo 应用领域
MOSAIC 静态存储器内存集成电路
页数 文件大小 规格书
4页 238K
描述
Standard SRAM, 1MX8, 20ns, CMOS, PBGA48, BGA-48

MSM81000BI-020/48D 技术参数

生命周期:Contact Manufacturer零件包装代码:BGA
包装说明:LBGA,针数:48
Reach Compliance Code:unknownECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41风险等级:5.67
最长访问时间:20 nsJESD-30 代码:R-PBGA-B48
内存密度:8388608 bit内存集成电路类型:STANDARD SRAM
内存宽度:8功能数量:1
端子数量:48字数:1048576 words
字数代码:1000000工作模式:ASYNCHRONOUS
组织:1MX8封装主体材料:PLASTIC/EPOXY
封装代码:LBGA封装形状:RECTANGULAR
封装形式:GRID ARRAY, LOW PROFILE并行/串行:PARALLEL
认证状态:Not Qualified座面最大高度:1.5 mm
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):4.5 V
标称供电电压 (Vsup):5 V表面贴装:YES
技术:CMOS端子形式:BALL
端子节距:1 mm端子位置:BOTTOM
Base Number Matches:1

MSM81000BI-020/48D 数据手册

 浏览型号MSM81000BI-020/48D的Datasheet PDF文件第2页浏览型号MSM81000BI-020/48D的Datasheet PDF文件第3页浏览型号MSM81000BI-020/48D的Datasheet PDF文件第4页 
MSM81000B - 020  
Issue 5.0 December 1999  
Description  
Block Diagram  
The MSM81000B is a 1M x 8 SRAM monolithic  
device available in Chip Size BGA (Ball Grid Array)  
package, with access times of 20ns. The device is  
available to commercial and industrial temperature  
grades.  
/CS  
/OE  
/WE  
A0  
A1  
A2  
A3  
A4  
A5  
A6  
A7  
A8  
D0  
D1  
D2  
D3  
D4  
D5  
D6  
D7  
The Chip Size BGA provides an ultra high density  
memory packaging solution.  
The Chip Size BGA occupies less than 50% of the  
board area of conventional SOP, SOJ and TSOP II  
packages.  
1M x 8  
SRAM  
Features  
• Access times of 20 ns.  
• 5V + 10%  
• Commercial&Industrialtemperaturegrades  
• Chip Size BGA.  
Pin Definition  
See page 2.  
• 48 pad, 1mm pad pitch, package.  
• Eutectic 63/67 solder ball attach.  
• Low Power Dissipation.  
Operating  
Standby(CMOS) 140mW(max)  
• Completely Static Operation.  
2 W (max)  
Pin Functions  
• 4layerBTsubstratewithpowerandgroundplanes.  
Description  
Signal  
A0~A19  
D0~D7  
/CS  
• Outline, dimensions and pinout will remain the  
same in the event of a die shrink.  
Address Input  
Data Input/Output  
Chip Select  
Write Enable  
Output Enable  
No Connect  
Power  
/WE  
Package Details  
/OE  
48D - 48 Ball, 1mm pitch Chip Size BGA  
Max. Dimensions (mm) - 13.00 x 11.00 x 1.50  
NC  
VCC  
GND  
Ground  
11403 West Bernardo Court, Suite 100, San Diego, CA92127.  
TEL (001) 858 674 2233, Fax No. (001) 858 674 2230 E-mail: sales@mosaicsemi.com  

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