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MS2212 PDF预览

MS2212

更新时间: 2024-11-17 21:55:47
品牌 Logo 应用领域
ADPOW 晶体晶体管射频微波电子航空
页数 文件大小 规格书
3页 423K
描述
RF & MICROWAVE TRANSISTORS AVIONICS APPLICATIONS

MS2212 技术参数

生命周期:Transferred包装说明:FLANGE MOUNT, S-CDFM-F2
Reach Compliance Code:unknown风险等级:5.63
其他特性:HIGH RELIABILITY外壳连接:BASE
最大集电极电流 (IC):1.8 A配置:SINGLE
最高频带:L BANDJESD-30 代码:S-CDFM-F2
元件数量:1端子数量:2
封装主体材料:CERAMIC, METAL-SEALED COFIRED封装形状:SQUARE
封装形式:FLANGE MOUNT极性/信道类型:NPN
认证状态:Not Qualified表面贴装:YES
端子形式:FLAT端子位置:DUAL
晶体管应用:AMPLIFIER晶体管元件材料:SILICON
Base Number Matches:1

MS2212 数据手册

 浏览型号MS2212的Datasheet PDF文件第2页浏览型号MS2212的Datasheet PDF文件第3页 
MS2212  
RF & MICROWAVE TRANSISTORS  
AVIONICS APPLICATIONS  
Features  
960 – 1215 MHz  
28 VOLTS  
INPUT/OUTPUT MATCHING  
POUT = 15 WATTS  
GP = 8.1 dB MINIMUM  
COMMON BASE CONFIGURATION  
DESCRIPTION:  
The MS2212 is designed for specialized avionics applications,  
including JTIDS where power is providedunder pulse formats  
utilizing short pulse widths and highburst or overall duty cycles.  
ABSOLUTE MAXIMUM RATINGS (Tcase = 25°C)  
Symbol  
PDISS  
IC  
Parameter  
Value  
50  
1.8  
Unit  
W
A
Power Dissipation  
Device Current  
VCC  
TJ  
TSTG  
Collector - Supply Voltage  
Junction Temperature  
Storage Temperature  
32  
V
°C  
°C  
250  
- 65 to +200  
Thermal Data  
RTH(j-c)  
Junction-Case Thermal Resistance  
3.0  
°C/W  
12-10-2002  

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