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MRFE6VP5600H

更新时间: 2024-11-06 02:52:35
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恩智浦 - NXP /
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RF Power Field Effect Transistors

MRFE6VP5600H 数据手册

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Document Number: MRFE6VP5600H  
Rev. 1, 1/2011  
Freescale Semiconductor  
Technical Data  
RF Power Field Effect Transistors  
High Ruggedness N--Channel  
MRFE6VP5600HR6  
MRFE6VP5600HSR6  
Enhancement--Mode Lateral MOSFETs  
These high ruggedness devices are designed for use in high VSWR industrial  
(including laser and plasma exciters), broadcast (analog and digital), aerospace  
and radio/land mobile applications. They are unmatched input and output  
designs allowing wide frequency range utilization, between 1.8 and 600 MHz.  
1.8--600 MHz, 600 W CW, 50 V  
LATERAL N--CHANNEL  
BROADBAND  
Typical Performance: VDD = 50 Volts, IDQ = 100 mA  
P
(W)  
f
G
(dB)  
η
(%)  
IRL  
(dB)  
out  
ps  
D
RF POWER MOSFETs  
Signal Type  
(MHz)  
Pulsed (100 μsec,  
600 Peak  
230  
25.0  
74.6  
-- 1 8  
20% Duty Cycle)  
CW  
600 Avg.  
230  
24.6  
75.2  
-- 1 7  
Capable of Handling a Load Mismatch of 65:1 VSWR, @ 50 Vdc,  
230 MHz, at all Phase Angles, Designed for Enhanced Ruggedness  
600 Watts Pulsed Peak Power, 20% Duty Cycle, 100 μsec  
CASE 375D--05, STYLE 1  
NI--1230  
Features  
Unmatched Input and Output Allowing Wide Frequency Range Utilization  
MRFE6VP5600HR6  
Device can be used Single--Ended or in a Push--Pull Configuration  
Qualified Up to a Maximum of 50 VDD Operation  
Characterized from 30 V to 50 V for Extended Power Range  
Suitable for Linear Application with Appropriate Biasing  
Integrated ESD Protection with Greater Negative Gate--Source Voltage  
Range for Improved Class C Operation  
CASE 375E--04, STYLE 1  
NI--1230S  
MRFE6VP5600HSR6  
Characterized with Series Equivalent Large--Signal Impedance Parameters  
RoHS Compliant  
In Tape and Reel. R6 Suffix = 150 Units, 56 mm Tape Width, 13 inch Reel.  
For R5 Tape and Reel options, see p. 12.  
PARTS ARE PUSH--PULL  
Table 1. Maximum Ratings  
Rating  
Symbol  
Value  
--0.5, +130  
--6.0, +10  
-- 65 to +150  
150  
Unit  
Vdc  
Vdc  
°C  
RF /V  
RF /V  
out DS  
3
4
1
2
in GS  
Drain--Source Voltage  
Gate--Source Voltage  
Storage Temperature Range  
Case Operating Temperature  
V
DSS  
V
GS  
T
stg  
RF /V  
out DS  
RF /V  
in GS  
T
C
°C  
Total Device Dissipation @ T = 25°C  
Derate above 25°C  
P
1667  
8.33  
W
W/°C  
C
D
(Top View)  
(1,2)  
Figure 1. Pin Connections  
Operating Junction Temperature  
T
J
225  
°C  
Table 2. Thermal Characteristics  
(2,3)  
Characteristic  
Symbol Value  
Unit  
Thermal Resistance, Junction to Case  
°C/W  
Case Temperature 68°C, 600 W Pulsed, 100 μsec Pulse Width, 20% Duty Cycle, 100 mA, 230 MHz  
Case Temperature 60°C, 600 W CW, 100 mA, 230 MHz  
Z
R
0.022  
0.12  
θ
JC  
θ
JC  
1. Continuous use at maximum temperature will affect MTTF.  
2. MTTF calculator available at http://www.freescale.com/rf. Select Software & Tools/Development Tools/Calculators to access  
MTTF calculators by product.  
3. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf.  
Select Documentation/Application Notes -- AN1955.  
© Freescale Semiconductor, Inc., 2010--2011. All rights reserved.  

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