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MRF173

更新时间: 2024-11-19 22:45:59
品牌 Logo 应用领域
泰科 - TE 晶体晶体管射频放大器局域网
页数 文件大小 规格书
8页 148K
描述
N-CHANNEL BROADBAND RF POWER MOSFET

MRF173 技术参数

是否Rohs认证: 符合生命周期:Transferred
针数:4Reach Compliance Code:unknown
ECCN代码:EAR99风险等级:5.33
配置:SINGLE最小漏源击穿电压:65 V
最大漏极电流 (ID):9 AFET 技术:METAL-OXIDE SEMICONDUCTOR
最高频带:VERY HIGH FREQUENCY BANDJESD-30 代码:O-CRFM-F4
元件数量:1端子数量:4
工作模式:ENHANCEMENT MODE封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装形状:ROUND封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
认证状态:Not Qualified表面贴装:NO
端子形式:FLAT端子位置:RADIAL
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:AMPLIFIER
晶体管元件材料:SILICONBase Number Matches:1

MRF173 数据手册

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Order this document  
SEMICONDUCTOR TECHNICAL DATA  
by MRF173/D  
The RF MOSFET Line  
M
R
F
1
7
3
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N–Channel Enhancement Mode MOSFET  
80 W, 28 V, 175 MHz  
N–CHANNEL  
BROADBAND  
RF POWER MOSFET  
Designed for broadband commercial and military applications up to 200 MHz  
frequency range. The high–power, high–gain and broadband performance of  
this device make possible solid state transmitters for FM broadcast or TV  
channel frequency bands.  
Guaranteed Performance at 150 MHz, 28 V:  
Output Power = 80 W  
Gain = 11 dB (13 dB Typ)  
Efficiency = 55% Min. (60% Typ)  
D
Low Thermal Resistance  
Ruggedness Tested at Rated Output Power  
Nitride Passivated Die for Enhanced Reliability  
Low Noise Figure — 1.5 dB Typ at 2.0 A, 150 MHz  
Excellent Thermal Stability; Suited for Class A Operation  
G
CASE 211–11, STYLE 2  
S
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
65  
Unit  
Vdc  
Vdc  
Vdc  
Adc  
Drain–Source Voltage  
Drain–Gate Voltage  
V
DSS  
V
DGO  
65  
Gate–Source Voltage  
Drain Current — Continuous  
V
GS  
±40  
9.0  
I
D
Total Device Dissipation @ T = 25°C  
P
D
220  
Watts  
C
Derate above 25°C  
1.26  
W/°C  
Storage Temperature Range  
Operating Temperature Range  
T
–65 to +150  
200  
°C  
°C  
stg  
T
J
THERMAL CHARACTERISTICS  
Characteristic  
Thermal Resistance, Junction to Case  
Symbol  
Max  
Unit  
R
0.8  
°C/W  
θ
JC  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
C
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
Drain–Source Breakdown Voltage (V = 0 V, V = 0 V)  
I
D
= 50 mA  
V
(BR)DSS  
65  
V
DS  
GS  
Zero Gate Voltage Drain Current (V = 28 V, V = 0 V)  
I
2.0  
1.0  
mA  
µA  
DS  
GS  
DSS  
GSS  
Gate–Source Leakage Current (V = 40 V, V = 0 V)  
I
GS  
DS  
ON CHARACTERISTICS  
Gate Threshold Voltage (V = 10 V, I = 50 mA)  
V
1.0  
3.0  
6.0  
1.4  
V
V
DS  
D
GS(th)  
Drain–Source On–Voltage (V  
, V = 10 V, I = 3.0 A)  
DS(on) GS  
V
DS(on)  
D
Forward Transconductance (V = 10 V, I = 2.0 A)  
g
fs  
1.8  
2.2  
mhos  
DS  
D
(continued)  
NOTE — CAUTION — MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and  
packaging MOS devices should be observed.  
REV 10  
1

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