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MRF171A PDF预览

MRF171A

更新时间: 2024-11-17 22:45:59
品牌 Logo 应用领域
泰科 - TE 晶体晶体管射频放大器局域网
页数 文件大小 规格书
12页 225K
描述
MOSFET BROADBAND RF POWER FET

MRF171A 技术参数

是否Rohs认证: 符合生命周期:Transferred
针数:4Reach Compliance Code:unknown
ECCN代码:EAR99风险等级:5.45
配置:SINGLE最小漏源击穿电压:65 V
最大漏极电流 (ID):4.5 AFET 技术:METAL-OXIDE SEMICONDUCTOR
最高频带:VERY HIGH FREQUENCY BANDJESD-30 代码:O-CRFM-F4
元件数量:1端子数量:4
工作模式:ENHANCEMENT MODE封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装形状:ROUND封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
认证状态:Not Qualified表面贴装:NO
端子形式:FLAT端子位置:RADIAL
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:AMPLIFIER
晶体管元件材料:SILICON

MRF171A 数据手册

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Order this document  
SEMICONDUCTOR TECHNICAL DATA  
by MRF171A/D  
The RF MOSFET Line  
N–Channel Enhancement–Mode MOSFET  
Designed primarily for wideband large–signal output and driver stages from  
30–200 MHz.  
45 W, 150 MHz  
Guaranteed Performance at 150 MHz, 28 Vdc  
Output Power = 45 Watts  
MOSFET BROADBAND  
RF POWER FET  
Power Gain = 17 dB (Min)  
Efficiency = 60% (Min)  
Excellent Thermal Stability, Ideally Suited for Class A Operation  
Facilitates Manual Gain Control, ALC and Modulation Techniques  
100% Tested for Load Mismatch At All Phase Angles with 30:1 VSWR  
Low Crss – 8 pF @ V  
Gold Top Metal  
= 28 V  
DS  
D
Typical Data For Power Amplifier Applications in Industrial,  
Commercial and Amateur Radio Equipment  
Typical Performance at 30 MHz, 28 Vdc  
Output Power = 30 Watts (PEP)  
Power Gain = 20 dB (Typ)  
CASE 211–07, STYLE 2  
G
S
Efficiency = 50% (Typ)  
IMD(d3) (30 Watts PEP) –32 dB (Typ)  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
65  
Unit  
Vdc  
Vdc  
Adc  
Adc  
Drain–Gate Voltage  
Drain–Gate Voltage (R  
Gate–Source Voltage  
V
DSS  
= 1.0 M)  
V
DGR  
65  
GS  
V
GS  
±20  
4.5  
Drain Current — Continuous  
I
D
Total Device Dissipation @ T = 25°C  
Derate above 25°C  
P
D
115  
0.66  
Watts  
W/°C  
C
Storage Temperature Range  
Operating Junction Temperature  
T
65 to +150  
200  
°C  
°C  
stg  
T
J
THERMAL CHARACTERISTICS  
Characteristic  
Thermal Resistance, Junction to Case  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
Symbol  
Max  
Unit  
R
1.52  
°C/W  
θJC  
C
Characteristic  
Symbol  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
Drain–Source Breakdown Voltage  
(I = 50 mA, V = 0)  
V
65  
80  
Vdc  
mAdc  
µAdc  
(BR)DSS  
D
GS  
Zero Gate Voltage Drain Current  
(V = 0, V = 28 V)  
I
1.0  
1.0  
DSS  
GS  
Gate–Source Leakage Current  
(V = 20 V, V = 0)  
DS  
I
GSS  
GS DS  
NOTE – CAUTION – MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and  
packaging MOS devices should be observed.  
REV 2  
1

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