Document Number: MRF1570T1
Rev. 6, 5/2006
Freescale Semiconductor
Technical Data
Replaced by MRF1570NT1/FNT1. There are no form, fit or function changes with this
part replacement. N suffix added to part number to indicate transition to lead-free
terminations.
MRF1570T1
MRF1570FT1
RF Power Field Effect Transistors
N-Channel Enhancement-Mode Lateral MOSFETs
Designed for broadband commercial and industrial applications with frequen-
cies up to 470 MHz. The high gain and broadband performance of these
devices make them ideal for large-signal, common source amplifier applica-
tions in 12.5 volt mobile FM equipment.
470 MHz, 70 W, 12.5 V
LATERAL N-CHANNEL
BROADBAND
• Specified Performance @ 470 MHz, 12.5 Volts
Output Power — 70 Watts
Power Gain — 10 dB
RF POWER MOSFETs
Efficiency — 50%
CASE 1366-04, STYLE 1
TO-272-8 WRAP
PLASTIC
• Capable of Handling 20:1 VSWR, @ 15.6 Vdc, 470 MHz, 2 dB Overdrive
• Excellent Thermal Stability
MRF1570T1
• Characterized with Series Equivalent Large-Signal Impedance Parameters
• Broadband-Full Power Across the Band: 135-175 MHz
400-470 MHz
• Broadband Demonstration Amplifier Information Available Upon Request
• 200_C Capable Plastic Package
CASE 1366A-02, STYLE 1
TO-272-8
• Available in Tape and Reel. T1 Suffix = 500 Units per 44 mm, 13 inch Reel.
PLASTIC
MRF1570FT1
Table 1. Maximum Ratings
Rating
Symbol
Value
+0.5, +40
20
Unit
Vdc
Vdc
Drain-Source Voltage
Gate-Source Voltage
V
DSS
V
GS
Total Device Dissipation @ T = 25°C
Derate above 25°C
P
165
0.5
W
W/°C
C
D
Storage Temperature Range
Operating Junction Temperature
Table 2. Thermal Characteristics
T
- 65 to +150
200
°C
°C
stg
T
J
Characteristic
Symbol
Value
Unit
Thermal Resistance, Junction to Case
R
θ
JC
0.75
°C/W
Table 3. ESD Protection Characteristics
Test Conditions
Class
Human Body Model
1 (Minimum)
M2 (Minimum)
C2 (Minimum)
Machine Model
Charge Device Model
Table 4. Moisture Sensitivity Level
Test Methodology
Rating
Package Peak Temperature
Unit
Per JESD 22-A113, IPC/JEDEC J-STD-020
1
260
°C
NOTE - CAUTION - MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and
packaging MOS devices should be observed.
© Freescale Semiconductor, Inc., 2006. All rights reserved.
MRF1570T1 MRF1570FT1
RF Device Data
Freescale Semiconductor
1