Datasheet > MPZ2012S331AT

MPZ2012S331AT

更新时间： 2024-01-22 18:55:43

品牌	Logo	应用领域
义隆 - ELAN		PC
页数	文件大小	规格书
2页	65K
描述
Chip Beads(SMD) For Power Line

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中文翻译

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数据手册

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MPZ2012S331AT 数据手册

(1/2)

Conformity to RoHS Directive

Chip Beads(SMD)

For Power Line

MPZ Series MPZ2012 Type

FEATURES

SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD

• The MPZ series are multilayer chip impeders for power supply

line applications.

PATTERN

2+0.3, –0.1

• High miniaturized, these parts nonetheless exhibit low DC

resistance and high current handling capability.

• The products contain no lead and also support lead-free

soldering.

1.3

0.5 0.3

• It is a product conforming to RoHS directive.

Weight: 8mg

APPLICATIONS

Dimensions in mm

Noise elimination of DC power supply lines for USB interface

circuitry, personal computers, electronic games, hard disk drives,

and other general electronic equipment.

TEMPERATURE RANGES

Operating/storage –55 to +125°C

Also effective as a noise countermeasure in signal lines.

PACKAGING STYLE AND QUANTITIES

PRODUCT IDENTIFICATION

Packaging style

Taping

Quantity

4000 pieces/reel

MPZ 2012 S 331 A

(1) (2) (3) (4) (5) (6)

HANDLING AND PRECAUTIONS

(1)Series name

• Before soldering, be sure to preheat components. The preheat-

ing temperature should be set so that the temperature difference

between the solder temperature and product temperature does

not exceed 150°C.

(2)Dimensions L× W

(3)Material code

(4)Nominal impedance

331: 330Ω at 100MHz

(5)Characteristic type

(6)Packaging style

T: Taping

• After mounting components onto the printed circuit board, do not

apply stress through board bending or mishandling.

• The inductance value may change due to magnetic saturation if

the current exceeds the rated maximum.

• Do not expose the inductors to stray magnetic fields.

• Avoid static electricity discharge during handling.

• When hand soldering, apply the soldering iron to the printed cir-

cuit board only. Temperature of the iron tip should not exceed

350°C. Soldering time should not exceed 3 seconds.

RECOMMENDED SOLDERING CONDITION

REFLOW SOLDERING

10s max.

250 to 260˚C

230˚C

Natural

cooling

180˚C

150˚C

Preheating

60 to 120s

Soldering

30 to 60s

Time(s)

• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific

bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.

• Please contact our Sales office when your application are considered the following:

The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)

• All specifications are subject to change without notice.

004-03 / 20061022 / e9413_mpz.fm

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与MPZ2012S331AT相关器件

型号	品牌	获取价格	描述	数据表
MPZ2012S331AT000	TDK	获取价格	FERRITE BEAD 330 OHM 0805 1LN
MPZ2012S331ATD25	TDK	获取价格	Ferrite Chip, 1 Function(s), 2.5A, HALOGEN FREE AND ROHS COMPLIANT, EIA STD PACKAGE SIZE 0
MPZ2012S601A	ELAN	获取价格	Ferrite Beads
MPZ2012S601A	TI	获取价格	DRV2603 ERM/LRA Haptic Driver Evaluation Kit
MPZ2012S601AT	TDK	获取价格	Ferrite Chip, 1 Function(s), 2A, EIA STD PACKAGE SIZE 0805, 2 PIN
MPZ2012S601AT000	TDK	获取价格	Ferrite Chip, 1 Function(s), 2A,
MPZ2012S601ATD25	TDK	获取价格	Chip Beads For power line
MPZ2520SPH070AT000	TDK	获取价格	片式磁珠
MPZ2520SPH070ATD25	TDK	获取价格	片式磁珠
MPZ3216S500A	TDK	获取价格	Ferrite Chip, 1 Function(s), 3A

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