(1/4)
Conformity to RoHS Directive
Chip Beads(SMD)
For Power Line
MPZ Series MPZ1608 Type
FEATURES
MATERIAL CHARACTERISTICS
B material: This type is perfectly suited for fast digital signals. By
equalizing R components and X components that
beads possess at a frequency of 5MHz, it is able to
suppress overshooting, undershooting and ringing of
fast digital signals.
• This type is the best for energy-saving in the low DC resistance.
• The products contain no lead and also support lead-free
soldering.
• It is a product conforming to RoHS directive.
APPLICATIONS
R material:For wide frequency applications calling for broad
impedance characteristics.
Removal of power line noises of cellular phones, PCs, note PCs,
TVs, TV tuners, STBs, audio players, DVDs, DSCs, DVCs, game
machines, digital photo frames, car navigation system, PNDs, etc.
For digital signal line applications calling requiring
good waveform integrity. Impedance values selected
for effectiveness at 10 to 200MHz.
S material: Standard type that features impedance characteristics
similar to those of a typical ferrite core.
PRODUCT IDENTIFICATION
MPZ 1608 S 221 A
T
For signal line applications in which the blocking region
is near 100MHz. Impedance values selected for
effectiveness at 40 to 300MHz.
(1) (2) (3) (4) (5) (6)
(1) Series name
Y material: High frequency range type intended for the 100MHz
region and above.
(2) Dimensions L×W
(3) Material code
For signal line applications in which the signal
frequency is far from the cutoff frequency. Impedance
values selected for effectiveness at 80 to 400MHz.
D material:For applications calling for low insertion loss at low
frequencies and sharply increasing impedance at high
frequencies. Designed for high impedance at high
frequencies (300MHz to 1GHz) for signal line
applications.
(4) Nominal impedance
221: 220Ω at 100MHz
(5) Characteristic type
(6) Packaging style
T: Taping
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components. The preheat-
ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
TYPICAL MATERIAL CHARACTERISTICS
2500
D
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
2000
Y
1500
1000
S
R
500
0
B
10
100
1000
Frequency(MHz)
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• Please contact our Sales office when your application are considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• All specifications are subject to change without notice.
011-01 / 20100324 / e9413_mpz1608.fm