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MPC8270CRUQLD PDF预览

MPC8270CRUQLD

更新时间: 2024-09-14 10:30:23
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摩托罗拉 - MOTOROLA /
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72页 1234K
描述
Micro Peripheral IC

MPC8270CRUQLD 数据手册

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Advance Information  
MPC8280EC/D  
Rev.0.3, 6/2003  
MPC8280  
Hardware Specications  
t
This document contains detailed information on power considerations, DC/AC electrical  
characteristics, and AC timing specifications for .13µm (HiP7) members of the  
PowerQUICC II™ family of integrated communications processors—the MPC8280, the  
MPC8275, and the MPC8270 (collectively referred to throughout this document as the  
MPC8280).  
The following topics are addressed:  
Topic  
Page  
2
Section 1.1, “Features”  
Section 1.2, “Electrical and Thermal Characteristics”  
Section 1.2.1, “DC Electrical Characteristics”  
Section 1.2.2, “Thermal Characteristics”  
Section 1.2.3, “AC Electrical Characteristics”  
Section 1.3, “Clock Configuration Modes”  
Section 1.3.1, “Local Bus Mode”  
Section 1.3.2, “PCI Mode”  
6
6
10  
11  
19  
20  
22  
37  
67  
70  
Section 1.4, “Pinout”  
Section 1.5, “Package Description”  
Section 1.6, “Ordering Information”  
HiP7 members of the PowerQUICC II family are available in two packages—the standard ZU  
package and an alternate VR package—as shown in Table 1. Note that throughout this  
document references to the MPC8280 and the MPC8270 are inclusive of VR-package devices  
unless otherwise specified. For more information on VR packages, contact your Motorola  
sales office.  
Table 1. HiP7 PowerQUICC II Device Packages  
ZU  
VR  
(480 TBGA)  
(516 PBGA)  
MPC8280  
MPC8270  
MPC8275VR  
MPC8270VR  
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE  

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