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MPC5603BF1CLL4 PDF预览

MPC5603BF1CLL4

更新时间: 2023-12-18 00:00:00
品牌 Logo 应用领域
恩智浦 - NXP 外围集成电路
页数 文件大小 规格书
106页 1693K
描述
MICROCONTROLLER, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, LQFP-100

MPC5603BF1CLL4 技术参数

生命周期:Transferred零件包装代码:QFP
包装说明:,针数:100
Reach Compliance Code:unknown风险等级:5.69
JESD-30 代码:S-PQFP-G100端子数量:100
封装主体材料:PLASTIC/EPOXY封装形状:SQUARE
封装形式:FLATPACK认证状态:Not Qualified
表面贴装:YES技术:CMOS
端子形式:GULL WING端子位置:QUAD
uPs/uCs/外围集成电路类型:MICROCONTROLLERBase Number Matches:1

MPC5603BF1CLL4 数据手册

 浏览型号MPC5603BF1CLL4的Datasheet PDF文件第2页浏览型号MPC5603BF1CLL4的Datasheet PDF文件第3页浏览型号MPC5603BF1CLL4的Datasheet PDF文件第4页浏览型号MPC5603BF1CLL4的Datasheet PDF文件第5页浏览型号MPC5603BF1CLL4的Datasheet PDF文件第6页浏览型号MPC5603BF1CLL4的Datasheet PDF文件第7页 
Freescale Semiconductor  
Data Sheet: Advance Information  
Document Number: MPC5604BC  
Rev. 8, 11/2010  
MPC5604B/C  
144 LQFP  
208 MAPBGA  
(20 x 20 x 1.4 mm)  
(17 x 17 x 1.7 mm)  
MPC5604B/C  
Microcontroller Data Sheet  
100 LQFP  
64 LQFP  
(14 x 14 x 1.4 mm)  
(10 x 10 x 1.4 mm)  
1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
1.1 Document overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
1.2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
Package pinouts and signal descriptions . . . . . . . . . . . . . . . . . 8  
3.1 Package pinouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
3.2 Pin muxing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32  
4.1 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32  
4.2 Parameter classification . . . . . . . . . . . . . . . . . . . . . . . . 33  
4.3 NVUSRO register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33  
4.4 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . 35  
4.5 Recommended operating conditions . . . . . . . . . . . . . . 36  
4.6 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . 38  
4.7 I/O pad electrical characteristics . . . . . . . . . . . . . . . . . 40  
4.8 RESET electrical characteristics . . . . . . . . . . . . . . . . . 51  
4.9 Power management electrical characteristics . . . . . . . 53  
4.10 Low voltage domain power consumption . . . . . . . . . . . 56  
4.11 Flash memory electrical characteristics . . . . . . . . . . . . 58  
4.12 Electromagnetic compatibility (EMC) characteristics . . 62  
4.13 Fast external crystal oscillator (4 to 16 MHz) electrical  
characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64  
4.14 Slow external crystal oscillator (32 kHz) electrical  
characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67  
4.15 FMPLL electrical characteristics. . . . . . . . . . . . . . . . . . 69  
4.16 Fast internal RC oscillator (16 MHz) electrical  
characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70  
4.17 Slow internal RC oscillator (128 kHz) electrical  
characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70  
4.18 ADC electrical characteristics. . . . . . . . . . . . . . . . . . . . 72  
4.19 On-chip peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . 79  
Package characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89  
5.1 Package mechanical data. . . . . . . . . . . . . . . . . . . . . . . 89  
Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100  
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . 100  
®
32-bit MCU family built on the Power Architecture for  
automotive body electronics applications  
2
3
Features  
Single issue, 32-bit CPU core complex (e200z0)  
®
— Compliant with the Power Architecture  
4
embedded category  
— Includes an instruction set enhancement  
allowing variable length encoding (VLE) for  
code size footprint reduction. With the optional  
encoding of mixed 16-bit and 32-bit  
instructions, it is possible to achieve significant  
code size footprint reduction.  
Up to 512 KB on-chip code flash supported with the  
flash controller  
64 (4 × 16) KB on-chip data flash memory with ECC  
Up to 48 KB on-chip SRAM  
Memory protection unit (MPU) with 8 region  
descriptors and 32-byte region granularity  
Interrupt controller (INTC) with 148 interrupt  
vectors, including 16 external interrupt sources and  
18 external interrupt/wakeup sources  
Frequency modulated phase-locked loop (FMPLL)  
Crossbar switch architecture for concurrent access to  
peripherals, flash, or RAM from multiple bus  
masters  
5
6
7
Boot assist module (BAM) supports internal flash  
programming via a serial link (CAN or SCI)  
Timer supports input/output channels providing a  
range of 16-bit input capture, output compare, and  
pulse width modulation functions (eMIOS-lite)  
10-bit analog-to-digital converter (ADC)  
3 serial peripheral interface (DSPI) modules  
This document contains information on a product under development. Freescale reserves the  
right to change or discontinue this product without notice.  
© Freescale Semiconductor, Inc., 2009, 2010. All rights reserved.  

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