LESHAN RADIO COMPANY, LTD.
Bias Resistor Transistor
PNP Silicon Surface Mount Transistor with
MMUN2211RLT1
MMUN2212RLT1
MMUN2213RLT1
MMUN2214RLT1
MMUN2215RLT1
MMUN2230RLT1
MMUN2231RLT1
MMUN2232RLT1
MMUN2233RL34
Monolithic Bias Resistor Network
This new series of digital transistors is designed to replace a single device and its
external resistor bias network. The BRT (Bias Resistor Transistor) contains a single
transistor with a monolithic bias network consisting of two resistors; a series base
resistor and a base-emitter resistor.The BRT eliminates these individual components
by integrating them into a single device. The use of a BRT can reduce both system
cost and board space. The device is housed in the SOT-23 package which is
designed for low power surface mount applications.
Simplifies Circuit Design
Reduces Board Space
Reduces Component Count
The SOT-23 package can be soldered using wave or
reflow. The modified gull-winged leads absorb thermal
stress during soldering eliminating the possibility of
damage to the die.
Available in 8 mm embossed tape and reel. Use the
Device Number to order the 7 inch/3000 unit reel.
NPN SILICON
BIAS RESISTOR
TRANSISTOR
Replace “T1” with “T3” in the Device Number to order
the 13 inch/10,000 unit reel.
PIN3
3
Collector
PIN1
base
R1
(output)
(Input)
R2
1
PIN2
2
Emitter
(Ground)
CASE 318–08, STYLE 6
SOT– 23 (TO–236AB)
MAXIMUM RATINGS (T A = 25°C unless otherwise noted)
Rating
Symbol
VCBO
V CEO
IC
Value
50
Unit
Vdc
Collector-Base Voltage
Collector-Emitter Voltage
50
Vdc
Collector Current
Total Power Dissipation @ T A = 25°C (1)
100
200
1.6
mAdc
mW
P D
Derate above 25°C
mW/°C
THERMAL CHARACTERISTICS
Rating
Symbol
RθJA
Value
Unit
Thermal Resistance — Junction-to-Ambient (surface mounted)
Operating and Storage Temperature Range
Maximum Temperature for Soldering Purposes
Time in Solder Bath
625
°C/W
TJ , Tstg
–65 to +150
°C
°C
260
10
T L
Sec
DEVICE MARKING AND RESISTOR VALUES
Device
Marking
R1 (K)
R2 (K)
MMUN2211RLT1
A8A
10
10
MMUN2212RLT1
MMUN2213RLT1
MMUN2214RLT1
MMUN2215RLT1(2)
MMUN2216RLT1(2)
MMUN2230RLT1(2)
MMUN2231RLT1(2)
MMUN2232RLT1(2)
MMUN2233RLT1(2)
MMUN2234RLT1(2)
A8B
A8C
A8D
A8E
A8F
A8G
A8H
A8J
A8K
A8L
22
47
10
10
4.7
1
22
47
47
1
2.2
4.7
4.7
22
2.2
4.7
47
47
1. Device mounted on a FR-4 glass epoxy printed circuit board using the minimum recommended footprint.
2. New devices. Updated curves to follow in subsequent data sheets.
Q2–1/8