MMSZ5261C

更新时间： 2023-11-02 19:30:25

品牌	Logo	应用领域
美微科 - MCC		/
页数	文件大小	规格书
4页	411K
描述
Tape : 3K/Reel, 120K/Ctn;

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数据手册

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MMSZ5261C 数据手册

MMSZ5221B

THRU

MMSZ5259B

M C C

ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents

21201 Itasca Street Chatsworth

ꢆꢋꢅꢌꢍꢎꢍꢍ

ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ

$ꢉ%ꢒꢅ ꢅ ꢅ ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ

Features

500 mW

Planar Die construction

500mW Power Dissipation

Zener Voltages from 2.4V - 39V

Zener Diodes

2.4 to 39 Volts

Ideally Suited for Automated Assembly Processes

Mechanical Data

Case: SOD-123, Molded Plastic

SOD123

Terminals: Solderable per MIL-STD-202, Method 208

Approx. Weight: 0.008 grams

Mounting Position: Any

Storage & Operating Temperature: -55^oC to +150^oC

Maximum Ratings @ 25^oC Unless Otherwise Specified

Zener Current

Maximum Forward

Voltage

I_F

V_F

100

1.2

Power Dissipation

(Notes A)

Pe ak Forward Surge IFSM

Current (Notes B)

P_(AV)

500

4.0

mWatt

Amps

NOTES:

DIMENSIONS

A. Mountedon5.0mm2(.013mmthick)landareas.

B. Measured on 8.3ms, single half sine-wave or equivalent

squarewave, dutycycle=4pulsesperminutemaximum.

DIM

INCHES

MIN

NOTE

MAX

.154

.110

.071

.053

.028

.008

---

MIN

3.60

2.50

1.40

0.95

0.50

---

MA X

3.90

2.80

1.80

1.35

0.70

0.20

---

.141

.098

.055

.037

.019

---

.016

---

0.40

---

.005

0.12

SUGGESTED SOLDER

PAD LAYOUT

2.0"

MAX

1.50”

www.mccsemi.com

12 3 4

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