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MMSZ5240C PDF预览

MMSZ5240C

更新时间: 2024-11-29 13:48:15
品牌 Logo 应用领域
美微科 - MCC /
页数 文件大小 规格书
4页 411K
描述
Tape : 3K/Reel, 120K/Ctn;

MMSZ5240C 数据手册

 浏览型号MMSZ5240C的Datasheet PDF文件第2页浏览型号MMSZ5240C的Datasheet PDF文件第3页浏览型号MMSZ5240C的Datasheet PDF文件第4页 
MMSZ5221B  
THRU  
MMSZ5259B  
M C C  
ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents  
21201 Itasca Street Chatsworth  
ꢆꢋꢅꢌꢍꢎꢍꢍ  
ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ  
$ꢉ%ꢒꢅ   ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ  
Features  
500 mW  
l
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Planar Die construction  
500mW Power Dissipation  
Zener Voltages from 2.4V - 39V  
Zener Diodes  
2.4 to 39 Volts  
Ideally Suited for Automated Assembly Processes  
Mechanical Data  
l
l
l
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Case: SOD-123, Molded Plastic  
SOD123  
Terminals: Solderable per MIL-STD-202, Method 208  
Approx. Weight: 0.008 grams  
A
B
Mounting Position: Any  
Storage & Operating Temperature: -55oC to +150oC  
C
E
Maximum Ratings @ 25oC Unless Otherwise Specified  
Zener Current  
Maximum Forward  
Voltage  
IF  
VF  
100  
1.2  
mA  
V
F
D
Power Dissipation  
(Notes A)  
Pe ak Forward Surge IFSM  
Current (Notes B)  
P(AV)  
500  
4.0  
mWatt  
Amps  
H
G
NOTES:  
DIMENSIONS  
A. Mountedon5.0mm2(.013mmthick)landareas.  
B. Measured on 8.3ms, single half sine-wave or equivalent  
squarewave, dutycycle=4pulsesperminutemaximum.  
DIM  
INCHES  
MIN  
MM  
NOTE  
MAX  
.154  
.110  
.071  
.053  
.028  
.008  
---  
MIN  
3.60  
2.50  
1.40  
0.95  
0.50  
---  
MA X  
3.90  
2.80  
1.80  
1.35  
0.70  
0.20  
---  
A
B
C
D
E
F
.141  
.098  
.055  
.037  
.019  
---  
G
H
.016  
---  
0.40  
---  
.005  
0.12  
SUGGESTED SOLDER  
PAD LAYOUT  
2.0"  
MAX  
1.50”  
1.50”  
www.mccsemi.com  

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