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MMSZ5238C-V PDF预览

MMSZ5238C-V

更新时间: 2024-11-28 13:01:27
品牌 Logo 应用领域
威世 - VISHAY 二极管齐纳二极管测试光电二极管
页数 文件大小 规格书
2页 44K
描述
DIODE 8.7 V, 0.5 W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, ROHS COMPLIANT, PLASTIC PACKAGE-2, Voltage Regulator Diode

MMSZ5238C-V 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete包装说明:R-PDSO-G2
针数:2Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8541.10.00.50
风险等级:5.23配置:SINGLE
二极管元件材料:SILICON二极管类型:ZENER DIODE
最大动态阻抗:8 ΩJESD-30 代码:R-PDSO-G2
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:2
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性:UNIDIRECTIONAL
最大功率耗散:0.5 W认证状态:Not Qualified
标称参考电压:8.7 V子类别:Voltage Reference Diodes
表面贴装:YES技术:ZENER
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子位置:DUAL处于峰值回流温度下的最长时间:40
最大电压容差:2%工作测试电流:20 mA
Base Number Matches:1

MMSZ5238C-V 数据手册

 浏览型号MMSZ5238C-V的Datasheet PDF文件第2页 
NEW PRODUCT  
NEW PRODUCT  
NEW PRODUCT  
MMSZ5225 THRU MMSZ5267  
ZENER DIODES  
SOD-123  
FEATURES  
Silicon Planar Power Zener Diodes  
.022 (0.55)  
Standard Zener voltage tolerance is ± 5%  
with a “B” suffix. Other tolerances are  
available upon request.  
Cathode Mark  
Top View  
These diodes are also available in Mini-MELF case with  
the designation ZMM5225 ... ZMM5267, DO-35 case with  
type designation 1N5225 ... 1N5267 and SOT-23 case  
with the type designation MMBZ5225 ... MMBZ5267.  
.067 (1.70)  
.055 (1.40)  
min. .010 (0.25)  
MECHANICAL DATA  
Case: SOD-123 Plastic Case  
Weight: approx. 0.01 g  
Dimensions in inches and (millimeters)  
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS  
Ratings at 25°C ambient temperature unless otherwise specified.  
SYMBOL  
VALUE  
UNIT  
Zener Current (see Table “Characteristics”)  
Power Dissipation at TL = 75°C  
Maximum Junction Temperature  
Storage Temperature Range  
Ptot  
Tj  
500(1)  
150  
mW  
°C  
TS  
-65 to +175  
°C  
SYMBOL  
RΘJA  
VF  
MIN.  
TYP.  
MAX.  
UNIT  
Thermal Resistance Junction to Ambient Air  
Forward Voltage at IF = 10 mA  
340(1)  
0.9  
°C/W  
Volts  
NOTES:  
(1) FR-4 or FR-5 board with minimum recommended solder pad layout.  
1/20/99  

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