MMSZ5221B - MMSZ5259B
500mW SURFACE MOUNT ZENER DIODE
SPICE MODELS: MMSZ5221B MMSZ5223B MMSZ5225B MMSZ5226B MMSZ5227B MMSZ5228B MMSZ5229B MMSZ5230B MMSZ5231B MMSZ5232B
MMSZ5233B MMSZ5234B MMSZ5235B MMSZ5236B MMSZ5237B MMSZ5238B MMSZ5239B MMSZ5240B MMSZ5241B MMSZ5242B MMSZ5243B
MMSZ5245B MMSZ5246B MMSZ5248B MMSZ5250B MMSZ5251B MMSZ5252B MMSZ5254B MMSZ5255B MMSZ5256B MMSZ5257B MMSZ5258B MMSZ5259B
Features
·
·
·
·
Planar Die Construction
500mW Power Dissipation
General Purpose, Medium Current
Ideally Suited for Automated Assembly
Processes
SOD-123
Min
·
Also Available in Lead Free Version
Dim
A
Max
3.85
2.85
1.70
1.35
Mechanical Data
3.55
2.55
1.40
—
·
·
·
·
Case: SOD-123, Plastic
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020A
Terminals: Solderable per MIL-STD-202,
Method 208
Also Available in Lead Free Plating (Matte Tin
Finish). Please see Ordering Information,
Note 5, on Page 2
B
H
D
J
C
G
D
E
0.55 Typical
0.25
0.11 Typical
A
B
G
H
—
·
E
C
J
—
0.10
·
·
·
·
Polarity: Cathode Band
Marking: See Below
Weight: 0.01 grams (approx.)
Ordering Information: See Page 2
a
0°
8°
All Dimensions in mm
@ TA = 25°C unless otherwise specified
Symbol
Maximum Ratings
Characteristic
Value
0.9
Unit
V
Forward Voltage (Note 2)
@ IF = 10mA
(Note 1)
VF
Pd
Power Dissipation
500
mW
°C/W
°C
RqJA
Tj, TSTG
Thermal Resistance, Junction to Ambient Air
Operating and Storage Temperature Range
(Note 1)
350
-65 to +150
Notes:
1. Device mounted on ceramic PCB; 7.6 mm x 9.4 mm x 0.87 mm with pad areas 25 mm2.
2. Short duration test pulse used to minimize self-heating effect.
Marking Information
XX = Product Type Marking Code (See Page 2)
YM = Date Code Marking
Y = Year (ex: N = 2002)
M = Month (ex: 9 = September)
XX
Date Code Key
Year
1998
1999
2000
2001
2002
2003
2004
2005
Code
J
K
L
M
N
P
R
S
Month
Code
Jan
Feb
March
Apr
May
Jun
Jul
Aug
Sep
Oct
Nov
Dec
1
2
3
4
5
6
7
8
9
O
N
D
DS18010 Rev. 10 - 2
1 of 3
MMSZ5221B - MMSZ5259B
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ã Diodes Incorporated