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MMSZ5230BHE3 PDF预览

MMSZ5230BHE3

更新时间: 2024-11-28 14:49:59
品牌 Logo 应用领域
美微科 - MCC /
页数 文件大小 规格书
4页 450K
描述
Tape : 3K/Reel, 120K/Ctn;

MMSZ5230BHE3 数据手册

 浏览型号MMSZ5230BHE3的Datasheet PDF文件第2页浏览型号MMSZ5230BHE3的Datasheet PDF文件第3页浏览型号MMSZ5230BHE3的Datasheet PDF文件第4页 
MMSZ5221BHE3 THRU MMSZ5261BH3  
Features  
Halogen Free. “Green” Device (Note 1)  
AEC-Q101 Qualified  
500 mW  
Zener Diode  
2.4 to 47 Volts  
Planar Die Construction  
ESD Rating of 16kV per Human Body Model  
Moisture Sensitivity Level 1  
Epoxy Meets UL 94 V-0 Flammability Rating  
Lead Free Finish/RoHS Compliant ("P" Suffix Designates RoHS  
Compliant. See Ordering Information)  
Maximum Ratings  
SOD-123  
Operating Junction Temperature Range: -55°C to +150°C  
Storage Temperature Range: -55°C to +150°C  
Thermal Resistance : 340°C/W Junction to Ambient(Note 2)  
A
B
Symbol  
Parameter  
Rating  
Conditions  
C
E
PD  
Power Dissipation  
500mW  
Note 3  
Cathode Mark  
Maximum Forward  
Voltage  
H
IF=10mA  
VF  
0.9V  
D
Note: 1. Halogen free "Green” products are defined as those which contain <900ppm bromine,  
<900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.  
J
G
Note: 2. On FR - 4 Board With Minimum Recommended Solder Pad Layout  
Note: 3. Mounted on 5.0mm2(0.013mm Thick) Land Areas.  
DIMENSIONS  
INCHES MM  
MIN MAX MIN MAX  
0.140 0.152 3.55 3.85  
0.100 0.112 2.55 2.85  
0.055 0.071 1.40 1.80  
DIM  
NOTE  
A
B
C
D
E
G
H
J
---- 0.053  
----  
1.35  
0.018 0.026 0.45 0.65  
0.006  
---- 0.010  
---- 0.006  
----  
0.15  
----  
----  
----  
0.25  
0.15  
SUGGESTED SOLDER PAD LAYOUT  
2.36mm  
1.22mm  
0.91mm  
Rev.3-4-12012020  
1/4  
MCCSEMI.COM  

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