M C C
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TM
MMSTA92
Micro Commercial Components
Features
·
Lead Free Finish/RoHS Compliant ("P" Suffix designates
PNP Small Signal
Transistors
RoHS Compliant. See ordering information)
Epitaxial Planar Die Construction
Ideal for Medium Power Amplification and Switching
Ultra-small surface mount package
Marking:K3R
•
•
•
•
·
Epoxy meets UL 94 V-0 flammability rating
SOT-323
·
Moisure Sensitivity Level 1
Maximum Ratings
A
D
C
Symbol
VCEO
VCBO
VEBO
IC
Rating
Collector-Emitter Voltage
Collector-Base Voltage
Emitter-Base Voltage
Rating
300
300
5.0
100
200
-55 to +150
-55 to +150
Unit
V
V
C
B
V
Collector Current-Continuous (1) (3)
Power dissipation (1)
mA
mW
OC
OC
B
E
F
PC
E
TJ
TSTG
Junction Temperature
Storage Temperature
Electrical Characteristics @ 25OC Unless Otherwise Specified
H
G
J
Symbol
Parameter
Min
Max
Units
K
OFF CHARACTERISTICS
V(BR)CEO
V(BR)CBO
V(BR)EBO
ICBO
Collector-Emitter Breakdown Voltage
300
300
5.0
---
---
---
Vdc
Vdc
DIMENSIONS
(I =1.0mAdc, IB=0)
C
INCHES
MM
Collector-Base Breakdown Voltage
(I =100uAdc, I =0)
DIM
A
B
C
D
E
MIN
.071
.045
.079
MAX
.087
.053
.087
MIN
1.80
1.15
2.00
MAX
NOTE
2.20
1.35
2.20
C
E
Collector-Emitter Breakdown Voltage
---
Vdc
(I =100uAdc, IC=0)
E
.026 Nominal
0.65Nominal
1.20
.30
.000
.90
.100
.30
.047
.055
.016
.004
.039
.010
.016
1.40
.40
.100
1.00
.250
.40
Collector-Base Cutoff Current
(VCB=200Vdc,IE=0)
Emitter-Base Cutoff Current
(VCE=3.0Vdc, IC=0)
250
100
nAdc
nAdc
F
.012
.000
.035
.004
.012
G
H
J
IEBO
---
K
ON CHARACTERISTICS(2)
Suggested Solder
Pad Layout
0.70
hFE
DC Current Gain
(IC=1.0mAdc, VCE=10Vdc)
(IC=10mAdc, VCE=10Vdc)
(IC=30mAdc, VCE=10Vdc)
Collector-Emitter Saturation Voltage
25
40
25
---
---
---
---
0.5
---
---
---
0.90
VCE(sat)
VBE(sat)
Vdc
(I =20mAdc, IB=2.0mAdc)
C
Base-Emitter Saturation Voltage
---
0.9
Vdc
1.90
mm
(I =20mAdc, IB=2.0mAdc)
C
SMALL SIGNALCHARACTERISTICS
fT
Current-Gain-Bandwidth Product
50
---
---
MHz
pF
0.65
(VCE=20V, f=100MHz, IC=10mA)
Collector-Base Capacitance
(VCB=20V, f=1.0MHz, IE=0)
CCB
6.0
0.65
Note: 1. Valid provided that terminals are kept at ambient temperature.
2. Pulse test: Pulse width<300us, duty cycle<2%
3. When operated within safe operating area constraints.
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Revision: A
2011/01/01