Datasheet > MMST5401_1

MMST5401_1

更新时间： 2022-04-23 23:00:11

品牌	Logo	应用领域
美台 - DIODES		晶体晶体管
页数	文件大小	规格书
4页	201K
描述
PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR

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MMST5401_1 数据手册

SPICE MODEL: MMST5401

MMST5401

Lead-free Green

PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR

Features

Epitaxial Planar Die Construction

SOT-323

Complementary NPN Type Available (MMST5551)

Ideal for Low Power Amplification and Switching

Ultra-Small Surface Mount Package

Dim

Min

0.25

1.15

2.00

Max

0.40

1.35

2.20

Lead Free/RoHS Compliant (Note 2)

"Green" Device (Note 3 and 4)

0.65 Nominal

Mechanical Data

0.30

1.20

1.80

0.0

0.40

1.40

2.20

0.10

1.00

0.40

0.18

8°

Case: SOT-323

Case Material: Molded Plastic, "Green" Molding

Compound, Note 4. UL Flammability Classification

Rating 94V-0

0.90

0.25

0.10

0°

Moisture Sensitivity: Level 1 per J-STD-020C

Terminal Connections: See Diagram

Terminals: Solderable per MIL-STD-202, Method 208

Lead Free Plating (Matte Tin Finish annealed over

Alloy 42 leadframe).

All Dimensions in mm

Marking (See Page 2): K4M

Ordering & Date Code Information: See Page 2

Weight: 0.006 grams (approximate)

@ T_A= 25°C unless otherwise specified

Characteristic

Maximum Ratings

Symbol

V_CBO

V_CEO

V_EBO

I_C

Value

Unit

Collector-Base Voltage

-160

-150

Collector-Emitter Voltage

Emitter-Base Voltage

-5.0

Collector Current - Continuous (Note 1)

Power Dissipation (Note 1)

-200

°C/W

°C

P_d

200

R_qJA

Thermal Resistance, Junction to Ambient (Note 1)

Operating and Storage and Temperature Range

625

T_j, T_STG

-55 to +150

Note: 1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout

document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.

2. No purposefully added lead.

3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.

4. Product manufactured with Date Code 0609 (week 9, 2006) and newer are built with Green Molding Compound. Product

manufactured prior to Date Code 0609 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.

DS30170 Rev. 8 - 2

1 of 4

MMST5401

www.diodes.com

ã Diodes Incorporated

12 3 4

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