MMST2222A
NPN SMALL SIGNAL SURFACE MOUNT TRANSISTOR
Features
•
•
•
•
Epitaxial Planar Die Construction
SOT-323
A
Complementary PNP Type Available (MMST2907A)
Lead Free/RoHS Compliant (Note 2)
"Green" Device (Note 3 and 4)
Dim
A
B
C
D
E
Min
0.25
1.15
2.00
Max
0.40
1.35
2.20
C
C
B
Mechanical Data
B
E
•
•
Case: SOT-323
G
H
0.65 Nominal
Case Material: Molded Plastic, "Green" Molding Compound,
Note 4. UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020C
Terminals: Solderable per MIL-STD-202, Method 208
Lead Free Plating (Matte Tin Finish annealed over
Alloy 42 leadframe).
Terminal Connections: See Diagram
Marking Information: K3P - See Page 4
Ordering & Date Code Information: See Page 4
Weight: 0.006 grams (approximate)
0.30
1.20
1.80
0.0
0.40
1.40
2.20
0.10
1.00
0.40
0.18
8°
G
H
J
•
•
•
K
J
M
L
D
E
K
L
0.90
0.25
0.10
0°
•
•
•
•
C
M
α
E
B
All Dimensions in mm
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Collector-Base Voltage
Symbol
VCBO
VCEO
VEBO
IC
Value
75
Unit
V
Collector-Emitter Voltage
40
V
Emitter-Base Voltage
6.0
V
Collector Current – Continuous (Note 1)
Power Dissipation (Note 1)
600
mA
mW
°C/W
°C
200
Pd
Thermal Resistance, Junction to Ambient (Note 1)
Operating and Storage Temperature Range
625
Rθ
JA
-55 to +150
Tj, TSTG
Notes:
1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout
document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. No purposefully added lead.
3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
4. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
DS30080 Rev. 9 - 2
1 of 4
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MMST2222A
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