MMFTP3419K
P-Channel Enhancement Mode MOSFET
Features
Drain
• Advanced trench cell design
• Surface-mounted package
• Built-in G-S Protection Diode
• Typical ESD Protection HBM Class 1B
Gate
Classification
Voltage Range(V)
0A
0B
1A
1B
1C
2
< 125
1. Gate 2. Source 3. Drain
SOT-23 Plastic Package
Source
125 to < 250
250 to < 500
500 to < 1000
1000 to < 2000
2000 to < 4000
4000 to < 8000
≥ 8000
3A
3B
Applications
• Battery management
• High speed switch
• Portable appliances
• Low power DC to DC Converter
Absolute Maximum Ratings(at Ta = 25℃ unless otherwise specified)
Parameter Symbol
Value
Unit
V
Drain-Source Voltage
Gate-Source Voltage
Drain Current
-VDS
VGS
-ID
20
± 12
V
3.5
A
Peak Drain Current, Pulsed 1)
Power Dissipation 2)
-IDM
PD
14
A
t ≤ 10 s
1.4
W
℃
℃
Operating Junction Temperature Range
Storage Temperature Range
Tj
- 55 to + 150
- 55 to + 150
Tstg
Thermal Characteristics
Parameter
Symbol
RθJA
Max.
Unit
t ≤ 10 s
Steady State
90
125
Thermal Resistance from Junction to Ambient 2)
℃
/W
1) Pulse Test: Pulse Width ≤ 100 μs, Duty Cycle ≤ 2%,Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C.
2) Device mounted on FR-4 substrate PC board, 2oz copper, with 1-inch square copper plate in still air.
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Dated: 12/06/2023 Rev:03