MMFTP2309K
P-Channel Enhancement Mode MOSFET
Features
• Advanced trench cell design
• Built-in G-S Protection Diode
• Typical ESD Protection HBM Class 1B
Drain
Classification Voltage Range(V)
Gate
0A
0B
1A
1B
1C
2
< 125
125 to < 250
250 to < 500
500 to < 1000
1000 to < 2000
2000 to < 4000
4000 to < 8000
≥ 8000
1. Gate 2. Source 3. Drain
SOT-23 Plastic Package
Source
3A
3B
Applications
• Portable applications
• battery management
• high speed switch
Absolute Maximum Ratings(at Ta = 25℃ unless otherwise specified)
Parameter Symbol
Value
30
Unit
V
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Pulsed Drain Current 1)
Power Dissipation 2)
-VDS
VGS
-ID
± 20
V
4.2
A
-IDM
PD
30
A
1.38
W
℃
℃
t < 10 s
Operating Junction Temperature Range
Storage Temperature Range
Tj
- 55 to + 150
- 55 to + 150
Tstg
Thermal Characteristics
Parameter
Symbol
RθJA
Max.
100
Unit
Thermal Resistance - Junction to Ambient 2)
1) Pulse Test: Pulse Width ≤ 100 μs, Duty Cycle ≤ 2%,Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C.
2) Device mounted on FR-4 substrate PC board, 2oz copper, with 1-inch square copper plate in still air; 270℃/W when mounted on min.
copper pad .
℃/W
Steady State
1 / 6
®
Dated: 31/05/2023 Rev:03