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MMFT3055ET1 PDF预览

MMFT3055ET1

更新时间: 2024-11-11 19:15:11
品牌 Logo 应用领域
安森美 - ONSEMI 开关光电二极管晶体管
页数 文件大小 规格书
8页 94K
描述
1700mA, 60V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-261AA, CASE 318E-04, 4 PIN

MMFT3055ET1 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:TO-261AA包装说明:CASE 318E-04, 4 PIN
针数:4Reach Compliance Code:not_compliant
ECCN代码:EAR99HTS代码:8541.21.00.95
风险等级:5.23外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:60 V
最大漏极电流 (Abs) (ID):1.7 A最大漏极电流 (ID):1.7 A
最大漏源导通电阻:0.15 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-261AAJESD-30 代码:R-PDSO-G4
JESD-609代码:e0湿度敏感等级:3
元件数量:1端子数量:4
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):240
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):0.8 W
认证状态:Not Qualified子类别:FET General Purpose Powers
表面贴装:YES端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子位置:DUAL
处于峰值回流温度下的最长时间:30晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

MMFT3055ET1 数据手册

 浏览型号MMFT3055ET1的Datasheet PDF文件第2页浏览型号MMFT3055ET1的Datasheet PDF文件第3页浏览型号MMFT3055ET1的Datasheet PDF文件第4页浏览型号MMFT3055ET1的Datasheet PDF文件第5页浏览型号MMFT3055ET1的Datasheet PDF文件第6页浏览型号MMFT3055ET1的Datasheet PDF文件第7页 
MMFT3055E  
Power MOSFET  
1.7 Amp, 60 Volts  
N−Channel TMOS E−FETt SOT−223  
This advanced E−FET is a TMOS Medium Power MOSFET  
designed to withstand high energy in the avalanche and commutation  
modes. This new energy efficient device also offers a drain−to−source  
diode with a fast recovery time. Designed for low voltage, high speed  
switching applications in power supplies, dc−dc converters and PWM  
motor controls, these devices are particularly well suited for bridge  
circuits where diode speed and commutating safe operating areas are  
critical and offer additional safety margin against unexpected voltage  
transients. The device is housed in the SOT−223 package which is  
designed for medium power surface mount applications.  
http://onsemi.com  
V
R
TYP  
I MAX  
D
DSS  
DS(ON)  
60 V  
150 m  
1.7 A  
N−Channel  
2,4  
D
Features  
Silicon Gate for Fast Switching Speeds  
1
G
Low R  
— 0.15 max  
DS(on)  
The SOT−223 Package can be Soldered Using Wave or Reflow. The  
Formed Leads Absorb Thermal Stress During Soldering, Eliminating  
the Possibility of Damage to the Die  
S
3
MARKING  
DIAGRAM  
Available in 12 mm Tape and Reel  
4
Use MMFT3055ET1 to order the 7 inch/1000 unit reel.  
Use MMFT3055ET3 to order the 13 inch/4000 unit reel.  
1
2
3
3055  
LWW  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
C
SOT−223  
Rating  
Symbol  
Value  
60  
Unit  
Vdc  
Vdc  
CASE 318E  
STYLE 3  
Drain−to−Source Voltage  
V
DSS  
Gate−to−Source Voltage− Continuous  
Drain Current − Continuous  
V
GS  
± 20  
L
WW  
= Location Code  
= Work Week  
I
D
1.7  
6.8  
Adc  
Apk  
Drain Current − Single Pulse (t 10 ms)  
I
p
DM  
PIN ASSIGNMENT  
Total Power Dissipation @ T = 25°C  
Derate above 25°C (Note 1)  
P
D
0.8  
6.3  
Watts  
mW/°C  
A
4
Drain  
Operating and Storage Temperature  
Range  
T , T  
65 to  
150  
°C  
J
stg  
Single Pulse Drain−to−Source Avalanche  
E
AS  
mJ  
Energy − Starting T = 25°C  
J
(V = 60 Vdc, V = 10 Vdc, Peak  
168  
DD  
GS  
I = 1.7 Apk, L = 0.2 mH, R = 25 )  
L
G
1
2
3
Gate Drain Source  
Thermal Resistance  
− Junction to Ambient (surface mounted)  
°C/W  
°C  
R
156  
260  
θ
JA  
L
Maximum Lead Temperature for Soldering  
Purposes, 1/8from case for 10  
seconds  
T
ORDERING INFORMATION  
Device  
Package  
Shipping  
1. Power rating when mounted on FR−4 glass epoxy printed circuit board  
using recommended footprint.  
MMFT3055ET1  
MMFT3055ET3  
SOT−223 1000 Tape & Reel  
SOT−223 4000 Tape & Reel  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
Semiconductor Components Industries, LLC, 2004  
1
Publication Order Number:  
May, 2004 − Rev. 4  
MMFT3055E/D  
 

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