Datasheet > MMDT2227_2

MMDT2227_2

更新时间： 2024-11-19 12:20:07

品牌	Logo	应用领域
美台 - DIODES		晶体晶体管
页数	文件大小	规格书
4页	201K
描述
COMPLEMENTARY NPN / PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR

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中文翻译

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MMDT2227_2 数据手册

MMDT2227

COMPLEMENTARY NPN / PNP

SMALL SIGNAL SURFACE MOUNT TRANSISTOR

Features

•

Complementary Pairs

One 2222A Type (NPN)

One 2907A Type (PNP)

SOT-363

C₂

B₁

E₁

Dim

Min

0.10

1.15

2.00

Max

0.30

1.35

2.20

•

Epitaxial Planar Die Construction

Ideal for Low Power Amplification and Switching

Lead Free/RoHS Compliant (Note 2)

"Green" Device (Note 3 and 4)

E₂

B₂

C₁

0.65 Nominal

0.30

1.80

—

0.40

2.20

0.10

1.00

0.40

0.25

Mechanical Data

•

Case: SOT-363

Case Material: Molded Plastic. UL Flammability

Classification Rating 94V-0

Moisture Sensitivity: Level 1 per J-STD-020C

Terminals: Solderable per MIL-STD-202, Method 208

Lead Free Plating (Matte Tin Finish annealed over Alloy 42

leadframe)

Terminal Connections: See Diagram

Ordering & Date Code Information: See Page 4

Marking Information: K27, See Page 4

Weight: 0.006 grams (approximate)

0.90

0.25

0.10

•

Note: E1, B1, and C1 = 2907A Type (PNP)

E2, B2, and C2 = 2222A Type (NPN)

Type marking indicates orientation

8°

All Dimensions in mm

C₂

B₁

E₁

•

E₂

B₂

C₁

Maximum Ratings, Total Device @T_A= 25°C unless otherwise specified

Characteristic

Symbol

Value

200

Unit

Total Power Dissipation

(Note 1)

P_d

Thermal Resistance, Junction to Ambient

Operating and Storage Temperature Range

625

°C/W

°C

R_θ

-55 to +150

T_j, T_STG

Maximum Ratings, 2222A Type (NPN) @T_A= 25°C unless otherwise specified

Characteristic

Symbol

V_CBO

V_CEO

V_EBO

I_C

Value

Unit

Collector-Base Voltage

Collector-Emitter Voltage

Emitter-Base Voltage

6.0

Collector Current - Continuous

600

Maximum Ratings, 2907A Type (PNP) @T_A= 25°C unless otherwise specified

Characteristic

Symbol

V_CBO

V_CEO

V_EBO

I_C

Value

-60

Unit

Collector-Base Voltage

Collector-Emitter Voltage

Emitter-Base Voltage

-60

-5.0

-600

Collector Current - Continuous

Notes:

1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout

document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.

2. No purposefully added lead.

3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.

4. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date

Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.

MMDT2227

DS30122 Rev. 11 - 2

1 of 4

www.diodes.com

12 3 4

中文翻译

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