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MMBZ5251BTS-7-F PDF预览

MMBZ5251BTS-7-F

更新时间: 2024-11-12 04:25:35
品牌 Logo 应用领域
美台 - DIODES 二极管齐纳二极管测试光电二极管
页数 文件大小 规格书
4页 82K
描述
TRIPLE SURFACE MOUNT ZENER DIODE ARRAY

MMBZ5251BTS-7-F 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:R-PDSO-G6
针数:6Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.10.00.50
Factory Lead Time:19 weeks风险等级:5.44
其他特性:HIGH RELIABILITY配置:SEPARATE, 3 ELEMENTS
二极管元件材料:SILICON二极管类型:ZENER DIODE
最大正向电压 (VF):0.9 VJESD-30 代码:R-PDSO-G6
JESD-609代码:e3湿度敏感等级:1
元件数量:3端子数量:6
最高工作温度:150 °C最低工作温度:-65 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性:UNIDIRECTIONAL最大功率耗散:0.2 W
认证状态:Not Qualified标称参考电压:22 V
最大反向电流:0.1 µA反向测试电压:17 V
子类别:Other Diodes表面贴装:YES
技术:ZENER端子面层:Matte Tin (Sn)
端子形式:GULL WING端子位置:DUAL
处于峰值回流温度下的最长时间:40最大电压容差:5%
工作测试电流:5.6 mABase Number Matches:1

MMBZ5251BTS-7-F 数据手册

 浏览型号MMBZ5251BTS-7-F的Datasheet PDF文件第2页浏览型号MMBZ5251BTS-7-F的Datasheet PDF文件第3页浏览型号MMBZ5251BTS-7-F的Datasheet PDF文件第4页 
SPICE MODELS: MMBZ5221BTS MMBZ5223BTS MMBZ5225BTS MMBZ5226BTS MMBZ5227BTS MMBZ5228BTS MMBZ5229BTS  
MMBZ5230BTS MMBZ5231BTS MMBZ5232BTS MMBZ5233BTS MMBZ5234BTS MMBZ5235BTS MMBZ5236BTS MMBZ5237BTS  
MMBZ5238BTS MMBZ5239BTS MMBZ5240BTS MMBZ5241BTS MMBZ5242BTS MMBZ5243BTS MMBZ5245BTS MMBZ5246BTS  
MMBZ5248BTS MMBZ5250BTS MMBZ5251MBTS MMMBBZ525Z2BT5S M2MB2Z51254BBTSTMMSBZ525-5BTMS MMMBZ5B256BZTS5MM2BZ552597BTBS TS  
MMBZ5258BTS MMBZ5259BTS  
TRIPLE SURFACE MOUNT ZENER DIODE ARRAY  
Lead-free  
Features  
·
Three Isolated Zeners in Ultra-Small Surface Mount  
Package  
·
·
·
Ideally Suited for Automated Assembly Processes  
Lead Free/RoHS Compliant (Note 3)  
SOT-363  
Min  
Dim  
A
B
C
D
F
Max  
0.30  
1.35  
2.20  
A
Qualified to AEC-Q101 Standards for High Reliability  
0.10  
C1  
C2  
C3  
1.15  
C
B
KXX YM  
Mechanical Data  
·
2.00  
0.65 Nominal  
A1  
A2  
A3  
Case: SOT-363  
0.30  
1.80  
¾
0.40  
2.20  
0.10  
1.00  
0.40  
0.25  
8°  
·
Case Material: Molded Plastic. UL Flammability  
Classification Rating 94V-0  
G
H
H
J
·
·
·
Moisture Sensitivity: Level 1 per J-STD-020C  
K
J
M
Terminals: Solderable per MIL-STD-202, Method 208  
K
L
0.90  
0.25  
0.10  
0°  
Lead Free Plating (Matte Tin Finish annealed over Alloy 42  
leadframe).  
L
D
F
M
a
·
·
·
Orientation: See Diagram  
Marking: Marking Code (See Table on Page 2)  
Weight: 0.006 grams (approximate)  
All Dimensions in mm  
@ TA = 25°C unless otherwise specified  
Maximum Ratings  
Characteristic  
Symbol  
VF  
Value  
Unit  
V
Forward Voltage (Note 2)  
Power Dissipation (Note 1)  
@ IF = 10mA  
0.9  
200  
Pd  
mW  
°C/W  
°C  
RqJA  
Thermal Resistance, Junction to Ambient Air (Note 1)  
Operating and Storage Temperature Range  
625  
Tj, TSTG  
-65 to +150  
Notes:  
1. Mounted on FR4 PC Board with recommended pad layout which can be found on our website at  
http://www.diodes.com/datasheets/ap02001.pdf.  
2. Short duration test pulse used to minimize self-heating effect.  
3. No purposefully added lead.  
DS30184 Rev. 10 - 2  
1 of 4  
MMBZ5221BTS - MMBZ5259BTS  
www.diodes.com  
ã Diodes Incorporated  

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