MMBT7002D
N-Channel Enhancement Mode Field Effect Transistor
Features
• High density cell design for low RDS(ON)
• Voltage controlled small signal switching
• High saturation current capability
• High speed switching
1. Gate 2. Source 3. Gate
4. Drain 5. Source 6. Drain
SOT-26 Plastic Package
1
2
3
Absolute Maximum Ratings (Ta = 25℃)
Parameter
Symbol
VDSS
Value
Unit
V
Drain-Source Voltage
60
60
Drain-Gate Voltage (RGS ≤ 1 MΩ)
VDGR
V
Gate-Source Voltage
-Continuous
-Non Repetitive (tp < 50 µs)
-Continuous
-Pulsed
± 20
± 40
115
800
V
VGSS
ID
Maximum Drain Current
mA
Total Power Dissipation
Ptot
200
mW
Operating and Storage Temperature Range
Tj, Tstg
- 55 to + 150
℃
Characteristics at Ta = 25℃
Parameter
Symbol
BVDSS
Min.
Max.
Unit
Drain Source Breakdown Voltage
at ID = 10 µA
Zero Gate Voltage Drain Current
at VDS = 60 V
Gate-Body Leakage Current
at VGS = ± 20 V
Gate Threshold Voltage
at VDS = VGS, ID = 250 µA
On-State Drain Current
at VGS = 10 V, VDS = 7.5 V
60
-
1
V
µA
nA
V
IDSS
-
-
IGSS
± 100
2.5
-
VGS(th)
ID(ON)
1
500
mA
Drain-Source On-Voltage
at VGS = 10 V, ID = 500 mA
at VGS = 5 V, ID = 50 mA
-
-
3.75
1.5
VDS(ON)
V
V
Static Drain-Source On-Resistance
at VGS = 10 V, ID = 500 mA
Forward Transconductance
at VDS = 10 V, ID = 200 mA
Input Capacitance
at VDS = 25 V, f = 1 MHz
Output Capacitance
at VDS = 25 V, f = 1 MHz
Reverse Transfer Capacitance
at VDS = 25 V, f = 1 MHz
RDS(ON)
gFS
-
80
-
7.5
-
Ω
mS
pF
pF
pF
ns
Ciss
Coss
Crss
ton
50
25
5
-
-
Turn-On Time
-
20
20
at VDD = 30 V, RL= 150 Ω, ID = 0.2 A, VGS = 10V, RGEN = 25Ω
Turn-Off Time
at VDD = 30 V, RL= 150 Ω, ID = 0.2 A, VGS = 10V, RGEN = 25Ω
toff
-
ns
®
Dated: 04/10/2018 Rev:01