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MMBT5551-TP PDF预览

MMBT5551-TP

更新时间: 2024-11-21 10:52:27
品牌 Logo 应用领域
美微科 - MCC 晶体晶体管
页数 文件大小 规格书
2页 64K
描述
PNP Plastic Encapsulate Transistor

MMBT5551-TP 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:SMALL OUTLINE, R-PDSO-G3
针数:3Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:0.62
最大集电极电流 (IC):0.6 A集电极-发射极最大电压:160 V
配置:SINGLE最小直流电流增益 (hFE):50
JESD-30 代码:R-PDSO-G3JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:3最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:NPN最大功率耗散 (Abs):0.3 W
认证状态:Not Qualified子类别:Other Transistors
表面贴装:YES端子面层:Matte Tin (Sn)
端子形式:GULL WING端子位置:DUAL
处于峰值回流温度下的最长时间:10晶体管元件材料:SILICON
标称过渡频率 (fT):100 MHzBase Number Matches:1

MMBT5551-TP 数据手册

 浏览型号MMBT5551-TP的Datasheet PDF文件第2页 
M C C  
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20736 Marilla Street Chatsworth  
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TM  
MMBT5551  
Micro Commercial Components  
Features  
NPN Plastic  
Encapsulate  
Transistor  
Collector Current: ICM=0.6A  
Collector-Base Voltage: V(BR)CBO=180V  
Operating And Storage Temperatures –55OC to 150OC  
Capable of 0.3Watts of Power Dissipation  
Marking: G1  
Case Material:Molded Plastic. UL Flammability  
Classificatio Rating 94-0 and MSL Rating 1  
SOT-23  
A
D
Electrical Characteristics @ 25OC Unless Otherwise Specified  
Symbol  
C
Parameter  
Min  
Max  
Units  
B
C
OFF CHARACTERISTICS  
V(BR)CEO  
V(BR)CBO  
V(BR)EBO  
ICBO  
Collector -Emitter Breakdown Voltage  
160  
180  
6.0  
---  
---  
---  
Vdc  
Vdc  
E
B
(I =1.0mAdc, IB=0)  
C
F
E
Collector-Base Breakdown Voltage  
(IC=100uAdc, IE=0)  
Emitter-Base Breakdown Voltage  
(IE=10uAdc, IC=0)  
Collector Cutoff Current  
(VCB=120Vdc, IE=0)  
Emitter Cutoff Current  
(VEB=4.0Vdc, IC=0)  
---  
Vdc  
G
H
J
0.1  
0.1  
uAdc  
uAdc  
K
IEBO  
---  
DIMENSIONS  
MM  
INCHES  
MIN  
.110  
ON CHARACTERISTICS  
hFE-1  
DIM  
A
B
C
D
E
MAX  
.120  
.098  
.055  
.041  
.081  
.024  
.0039  
.044  
.007  
.020  
MIN  
2.80  
2.10  
1.20  
.89  
1.78  
.45  
.013  
MAX  
NOTE  
3.04  
2.64  
1.40  
1.03  
2.05  
.60  
.100  
1.12  
.180  
.51  
DC Current Gain  
80  
100  
50  
---  
200  
---  
---  
---  
---  
.083  
.047  
.035  
.070  
(VCE=5.0Vdc, I =1.0mAdc)  
C
hFE-2  
DC Current Gain  
(VCE=5.0Vdc, I =10mAdc)  
C
F
.018  
hFE-3  
DC Current Gain  
G
H
J
.0005  
(VCE=5.0Vdc, I =50mAdc)  
C
.035  
.003  
.015  
.89  
.085  
.37  
VCE(sat)  
VBE(sat)  
Collector-Emitter Saturation Voltage  
K
(I =50mAdc, IB=5.0mAdc)  
0.5  
1.0  
Vdc  
Vdc  
---  
---  
C
Suggested Solder  
Pad Layout  
Base-Emitter Saturation Voltage  
(I =50mAdc,IB=5.0mAdc)  
C
SMALL-SIGNAL CHARACTERISTICS  
.031  
.800  
fT  
Current Gain-Bandwidth Product  
(I =10mAdc, VCE=5.0Vdc, f=30MHz)  
100  
---  
MHz  
.035  
.900  
C
inches  
mm  
.079  
2.000  
.037  
.950  
.037  
.950  
www.mccsemi.com  
1 of 2  
Revision: 4  
2008/01/01  

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