SPICE MODEL: BAS16TW
MMBD4148TW / BAS16TW
SURFACE MOUNT FAST SWITCHING DIODE ARRAY
Lead-free
Features
A
·
·
·
·
·
Fast Switching Speed
SOT-363
Ultra-Small Surface Mount Package
Dim
A
B
C
D
F
Min
0.10
1.15
2.00
Max
0.30
1.35
2.20
For General Purpose Switching Applications
High Conductance
B
C
TOP VIEW
Lead Free/RoHS Compliant (Note 3)
G
H
0.65 Nominal
Mechanical Data
0.30
1.80
¾
0.40
2.20
0.10
1.00
0.40
0.25
8°
K
·
Case: SOT-363
M
H
J
·
Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
J
L
D
F
·
·
·
Moisture Sensitivity: Level 1 per J-STD-020C
K
L
0.90
0.25
0.10
0°
C3
C1
C2
Terminals: Solderable per MIL-STD-202, Method 208
Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe). Please See Ordering Information, Note 5, on
Page 2
M
a
A3
A1
A2
All Dimensions in mm
·
·
·
Polarity: See Diagram
Marking: KA2 (See Page 2)
Weight: 0.006 grams (approximate)
TOP VIEW
Maximum Ratings
@ TA = 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
VRM
Non-Repetitive Peak Reverse Voltage
100
V
VRRM
VRWM
VR
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
75
VR(RMS)
IFM
RMS Reverse Voltage
53
V
Forward Continuous Current (Note 1)
Average Rectified Output Current (Note 1)
Non-Repetitive Peak Forward Surge Current
300
150
mA
mA
IO
@ t = 1.0ms
@ t = 1.0s
2.0
1.0
IFSM
Pd
A
Power Dissipation (Note 1)
200
625
mW
°C/W
°C
R
qJA
Thermal Resistance Junction to Ambient Air (Note 1)
Operating and Storage Temperature Range
Tj , TSTG
-65 to +150
@ T = 25°C unless otherwise specified
Electrical Characteristics
A
Characteristic
Symbol
Min
Max
¾
Unit
Test Condition
V(BR)R
Reverse Breakdown Voltage (Note 2)
IR = 1mA
75
V
0.715
IF = 1.0mA
IF = 10mA
IF = 50mA
IF = 150mA
0.855
VF
Forward Voltage
¾
V
1.0
1.25
VR = 75V
1.0
50
30
25
mA
mA
mA
nA
VR = 75V, Tj = 150°C
VR = 25V, Tj = 150°C
VR = 20V
IR
Reverse Current (Note 2)
¾
VR = 0, f = 1.0MHz
CT
trr
Total Capacitance
¾
¾
2.0
4.0
pF
ns
IF = IR = 10mA,
Irr = 0.1 x IR, RL = 100W
Reverse Recovery Time
Notes:
1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout
document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration test pulse used to minimize self-heating effect.
3. No purposefully added lead.
DS30154 Rev. 9 - 2
1 of 3
MMBD4148TW / BAS16TW
www.diodes.com
ã Diodes Incorporated