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MM74HCT244 PDF预览

MM74HCT244

更新时间: 2024-11-22 23:02:43
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
7页 97K
描述
Inverting Octal 3-STATE Buffer Octal 3-STATE Buffer

MM74HCT244 数据手册

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February 1984  
Revised July 1999  
MM74HCT240 • MM74HCT244  
Inverting Octal 3-STATE Buffer • Octal 3-STATE Buffer  
The MM74HCT240 is an inverting buffer and the  
MM74HCT244 is a non-inverting buffer. Each device has  
General Description  
The MM74HCT240 and MM74HCT244 3-STATE buffers  
two active low enables (1G and 2G), and each enable inde-  
utilize advanced silicon-gate CMOS technology and are  
pendently controls 4 buffers.  
general purpose high speed inverting and non-inverting  
All inputs are protected from damage due to static dis-  
buffers. They possess high drive current outputs which  
charge by diodes to VCC and Ground.  
enable high speed operation even when driving large bus  
capacitances. These circuits achieve speeds comparable  
Features  
to low power Schottky devices, while retaining the low  
power consumption of CMOS. All three devices are TTL  
input compatible and have a fanout of 15 LS-TTL equiva-  
lent inputs.  
TTL input compatible  
Typical propagation delay: 14 ns  
3-STATE outputs for connection to system buses  
MM74HCT devices are intended to interface between TTL  
Low quiescent current: 80 µA  
and NMOS components and standard CMOS devices.  
These parts are also plug-in replacements for LS-TTL  
devices and can be used to reduce power consumption in  
existing designs.  
High output drive current: 6 mA (min)  
Ordering Code:  
Order Number  
MM74HCT240WM  
MM74HCT240SJ  
MM74HCT240MTC  
MM74HCT240N  
MM74HCT244WM  
MM74HCT244SJ  
MM74HCT244MTC  
MM74HCT244N  
Package Number  
M20B  
Package Description  
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300” Wide  
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide  
M20D  
MTC20  
N20A  
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide  
20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide  
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300” Wide  
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide  
M20B  
M20D  
MTC20  
N20A  
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide  
20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide  
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.  
Connection Diagrams  
Pin Assignments for DIP, SOIC, SOP and TSSOP  
Top View  
Top View  
MM74HCT240  
MM74HCT244  
© 1999 Fairchild Semiconductor Corporation  
DS005365  
www.fairchildsemi.com  

MM74HCT244 替代型号

型号 品牌 替代类型 描述 数据表
SN74HCT244NSRG4 TI

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