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MM74HC04N PDF预览

MM74HC04N

更新时间: 2024-11-16 22:46:07
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 栅极触发器逻辑集成电路光电二极管PC
页数 文件大小 规格书
7页 84K
描述
Hex Inverter

MM74HC04N 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:DIP
包装说明:DIP, DIP14,.3针数:14
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.1
Samacsys Confidence:Samacsys Status:Released
Samacsys PartID:582279Samacsys Pin Count:14
Samacsys Part Category:Undefined or MiscellaneousSamacsys Package Category:Other
Samacsys Footprint Name:DIP254P762X533-14Samacsys Released Date:2017-01-11 16:35:06
Is Samacsys:N系列:HC/UH
JESD-30 代码:R-PDIP-T14JESD-609代码:e3
长度:19.18 mm负载电容(CL):50 pF
逻辑集成电路类型:INVERTER最大I(ol):0.004 A
湿度敏感等级:1功能数量:6
输入次数:1端子数量:14
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:DIP
封装等效代码:DIP14,.3封装形状:RECTANGULAR
封装形式:IN-LINE包装方法:RAIL
峰值回流温度(摄氏度):NOT APPLICABLE电源:2/6 V
Prop。Delay @ Nom-Sup:24 ns传播延迟(tpd):120 ns
认证状态:Not Qualified施密特触发器:NO
座面最大高度:5.08 mm子类别:Gates
最大供电电压 (Vsup):6 V最小供电电压 (Vsup):2 V
标称供电电压 (Vsup):4.5 V表面贴装:NO
技术:CMOS温度等级:INDUSTRIAL
端子面层:Matte Tin (Sn)端子形式:THROUGH-HOLE
端子节距:2.54 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT APPLICABLE宽度:7.62 mm
Base Number Matches:1

MM74HC04N 数据手册

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September 1983  
Revised January 2005  
MM74HC04  
Hex Inverter  
General Description  
Features  
The MM74HC04 inverters utilize advanced silicon-gate  
CMOS technology to achieve operating speeds similar to  
LS-TTL gates with the low power consumption of standard  
CMOS integrated circuits.  
Typical propagation delay: 8 ns  
Fan out of 10 LS-TTL loads  
Quiescent power consumption: 10 µW maximum at  
room temperature  
The MM74HC04 is a triple buffered inverter. It has high  
noise immunity and the ability to drive 10 LS-TTL loads.  
The 74HC logic family is functionally as well as pin-out  
compatible with the standard 74LS logic family. All inputs  
are protected from damage due to static discharge by inter-  
nal diode clamps to VCC and ground.  
Low input current: 1 µA maximum  
Ordering Code:  
Package  
Order Number  
Package Description  
Number  
MM74HC04M  
M14A 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow  
Pb-Free 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow  
M14D Pb-Free 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide  
MTC14 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide  
MM74HC04M_NL  
MM74HC04SJ  
MM74HC04MTC  
MM74HC04MTC_NL MTC14 Pb-Free 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm  
Wide  
MM74HC04N  
N14A  
N14A  
14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide  
MM74HC04N_NL  
Pb-Free 14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide  
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.  
Pb-Free package per JEDEC J-STD-020B.  
Connection Diagram  
Logic Diagram  
Pin Assignments for DIP, SOIC, SOP and TSSOP  
1 of 6 Inverters  
Top View  
© 2005 Fairchild Semiconductor Corporation  
DS005069  
www.fairchildsemi.com  

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