MM5ZxxxST1G Series,
SZMM5ZxxxST1G Series
Zener Voltage Regulators
200 mW SOD−523 Surface Mount
This series of Zener diodes is packaged in a SOD−523 surface
mount package. They are designed to provide voltage regulation
protection and are especially attractive in situations where space is at a
premium. They are well suited for applications such as cellular
phones, hand held portables, and high density PC boards.
http://onsemi.com
SOD−523
CASE 502
PLASTIC
Specification Features
Standard Zener Breakdown Voltage Range −2.4 V to 18 V
Steady State Power Rating of 200 mW
Small Body Outline Dimensions:
0.047 x 0.032 (1.20 mm x 0.80 mm)
1
2
Cathode
Anode
Low Body Height: 0.028 (0.7 mm)
ESD Rating of Class 3 (> 16 kV) per Human Body Model
MARKING DIAGRAM
Tight Tolerance V
Z
AEC−Q101 Qualified and PPAP Capable
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
These are Pb−Free Devices*
XX MG
G
2
1
Mechanical Characteristics
CASE: Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94, V−0
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
QUALIFIED MAX REFLOW TEMPERATURE: 260C
Device Meets MSL 1 Requirements
XX = Specific Device Code
M
Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
MAXIMUM RATINGS
ORDERING INFORMATION
Rating
Symbol
Max
Unit
†
Device
Package
Shipping
Total Device Dissipation FR−5 Board,
P
D
MM5ZxxxST1G
SOD−523**
3,000 /
Tape & Reel
(Note 1) @ T = 25C
200
1.5
mW
mW/C
A
Derate above 25C
SZMM5ZxxxST1G SOD−523**
SZMM5ZxxxST5G SOD−523**
3,000 /
Tape & Reel
Thermal Resistance from
R
635
C/W
C
q
JA
Junction−to−Ambient
8,000 /
Tape & Reel
Junction and Storage Temperature Range
T , T
J
−65 to
+150
stg
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−4 Minimum Pad.
**This package is inherently Pb−Free.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 2 of
this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2012
1
Publication Order Number:
January, 2012 − Rev. 8
MM5Z2V4ST1/D