Datasheet > MM3Z3V6S

MM3Z3V6S

更新时间： 2024-09-21 12:32:47

品牌	Logo	应用领域
TYSEMI		/
页数	文件大小	规格书
3页	319K
描述
Planar Die Construction

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中文翻译

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MM3Z3V6S 数据手册

Product specification

MM3Z3V6S

SOD-323

Unit: mm

■ Features

+0.1

+0.05

1.7_-0.1

0.85_-0.05

● Planar Die Construction

● Ultra-Small Surface Mount Package

● Ideally Suited for Automated Assembly Processes

+0.1

2.6_-0.1

1.0max

0.475

0.375

■ Absolute Maximum Ratings Ta = 25℃

Parameter

Symbol

Rating

Unit

Power Dissipation

Forward Voltage

(Note 1)

200

0.9

@ IF = 10mA

Thermal Resistance, Junction to Ambient Air (Note 1)

Operating and Storage Temperature Range

RθJA

625

℃/W

℃

Tj, TSTG

-65 to +150

Note: 1.Part mounted on FR-4 PC board with recommended pad layout.

Electrical Characteristics @Ta=25℃ unless otherwise specified

■

Maximum Reverse

Current

Typical

Zener Voltage Range

(Note 2)

Maximum ZenerImpedance

(Note 3)

Temperature

Coefficient

@ IZT

(Note 2)

Type Number

mV/℃

Vz @ IZT

IR @ VR

IZT

ZZT @ IZT ZZK @ IZK

IZK

Min (V) Nom (V) Max (V)

0.5

μA

1.0

Min

-3.5

Max

MM3Z3V6S

3.4

3.6

3.8

1000

Notes: 2. Short duration test pulse used to minimize self-heating effect.

3. f = 1kHz.

■ Marking

Marking

http://www.twtysemi.com

1 of 3

sales@twtysemi.com

4008-318-123

12 3

中文翻译

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