MLG1608SR12JT

更新时间： 2024-02-01 11:58:19

品牌	Logo	应用领域
东电化 - TDK		电感器固定电感器测试射频感应器
页数	文件大小	规格书
4页	58K
描述
SMD Inductors(Coils) For High Frequency(Multilayer)

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技术参数
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MLG1608SR12JT 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Obsolete	包装说明：	0603
Reach Compliance Code：	compliant	ECCN代码：	EAR99
HTS代码：	8504.50.80.00	风险等级：	5.6
Is Samacsys：	N	大小写代码：	0603
构造：	Monolithic	型芯材料：	CERAMIC
直流电阻：	1.2 Ω	标称电感 (L)：	0.12 µH
电感器应用：	RF INDUCTOR	电感器类型：	GENERAL PURPOSE INDUCTOR
JESD-609代码：	e3	功能数量：	1
端子数量：	2	最高工作温度：	125 °C
最低工作温度：	-55 °C	封装高度：	0.8 mm
封装长度：	1.6 mm	封装形式：	SMT
封装宽度：	0.8 mm	包装方法：	TR
最小质量因数（标称电感时）：	14	最大额定电流：	0.3 A
自谐振频率：	650 MHz	系列：	MLG1608
形状/尺寸说明：	RECTANGULAR PACKAGE	屏蔽：	NO
特殊特征：	Q FACTOR IS MEASURED AT 100MHZ	表面贴装：	YES
端子面层：	Tin (Sn) - with Nickel (Ni) barrier	端子位置：	DUAL ENDED
端子形状：	WRAPAROUND	测试频率：	100 MHz
容差：	3%	Base Number Matches：	1

MLG1608SR12JT 数据手册

(1/4)

Conformity to RoHS Directive

SMD Inductors(Coils)

For High Frequency(Multilayer)

MLG Series MLG1608

FEATURES

PRODUCT IDENTIFICATION

MLG 1608 2N2

(1) (2) (3) (4) (5) (6)

• Nominal inductance values are supported from 1 to 680nH.

• Provides high Q characteristics.

• Advanced monolithic structure is formed using a multilayering

and sintering process with ceramic and conductive materials for

high-frequency.

(1) Series name

• It is a product conforming to RoHS directive.

(2) Dimensions

1608

1.6× 0.8mm (L× W)

APPLICATIONS

(3) Material code

For high-frequency applications including mobile phones, high

frequency modules (PA, VCO, FEM etc.), Bluetooth, W-LAN, UWB

and tuners.

(4) Inductance value

2N2

12N

R10

2.2nH

12nH

100nH

SHAPES AND DIMENSIONS

1.6 0.15

(5) Inductance tolerance

0.3nH

0.5nH

0.3 0.2

(6) Packaging style

Taping (reel)

SPECIFICATIONS

Operating temperature range

Storage temperature range

–55 to +125°C

–55 to +125°C [Unit of products]

Weight: 4mg

RECOMMENDED PC BOARD PATTERN

PACKAGING STYLE AND QUANTITIES

2.0

0.8

Packaging style

Taping

Quantity

4000 pieces/reel

HANDLING AND PRECAUTIONS

• Before soldering, be sure to preheat components.

The preheating temperature should be set so that the

temperature difference between the solder temperature and

product temperature does not exceed 150°C.

Dimensions in mm

RECOMMENDED SOLDERING CONDITION

REFLOW SOLDERING

• After mounting components onto the printed circuit board, do not

apply stress through board bending or mishandling.

• When hand soldering, apply the soldering iron to the printed

circuit board only. Temperature of the iron tip should not exceed

350°C. Soldering time should not exceed 3 seconds.

10s max.

250 to 260˚C

230˚C

Natural

cooling

180˚C

150˚C

Preheating

60 to 120s

Soldering

30 to 60s

Time(s)

• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific

bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.

• Please contact our Sales office when your application are considered the following:

The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)

• All specifications are subject to change without notice.

006-01 / 20080406 / e521_mlg1608.fm

12 3 4

中文翻译

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与MLG1608SR12JT相关器件

型号	品牌	获取价格	描述	数据表
MLG1608SR12JT000	TDK	获取价格	L=120nHQ=14
MLG1608SR12JTD25	TDK	获取价格	L=120nHQ=14
MLG1608SR15JT	TDK	获取价格	SMD Inductors(Coils) For High Frequency(Multilayer)
MLG1608SR15JT000	TDK	获取价格	L=150nHQ=14
MLG1608SR15JTD25	TDK	获取价格	General Purpose Inductor,
MLG1608SR18JT	TDK	获取价格	SMD Inductors(Coils) For High Frequency(Multilayer)
MLG1608SR18JT000	TDK	获取价格	General Purpose Inductor, 0.18uH, 5%, 1 Element, Ferrite-Core, SMD, 1608, CHIP, 1608, ROHS
MLG1608SR18JTD25	TDK	获取价格	L=180nHQ=14
MLG1608SR22JT	TDK	获取价格	SMD Inductors(Coils) For High Frequency(Multilayer)
MLG1608SR22JT000	TDK	获取价格	L=220nHQ=14

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