MLF Series MLF2012 Type
Inductors
For General Applications
SMD
FEATURES
PRODUCT IDENTIFICATION
• High-reliability monolithic structure.
• Ferrite core and magnetic shielding enables the design of com-
pact circuits with high packing density.
• Excellent solderability and high heat resistance permits either
flow or reflow soldering.
MLF 1608
A
1R0 K
T
(1) (2) (3) (4) (5) (6)
(1) Series name
(2) Dimensions L×W
1608
2012
1.6×0.8mm
2.0×1.25mm
APPLICATIONS
Personal computers, HDDs, or other various electronic appliances.
(3) Material code
SPECIFICATIONS
Operating temperature range
Storage temperature range
–25 to +85°C
(4) Inductance value
–40 to +85°C[Unit of products]
47N
R15
1R0
100
47nH[0.047µH]
0.15µH
1µH
RECOMMENDED REFLOW SOLDERING CONDITIONS
10µH
10s max.
220°C
200°C
(5) Inductance tolerance
Natural
cooling
K
±10%
±20%
M
150°C
(6) Packaging style
T
Preheating 60 to 120s min. 40s max.
Taping [reel]
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
Product’s thickness
0.8/0.85mm
1.25mm
( )
Time s
Quantity
4000 pieces/reel
2000 pieces/reel
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components.
The preheating temperature should be set so that the tempera-
ture difference between the solder temperature and product
temperature does not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• The inductance value may change due to magnetic saturation if
the current exceeds the rated maximum.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
300°C. Soldering time should not exceed 3 seconds.
Specifications which provide more details for the proper and safe use of the described product are available upon request.
All specifications are subject to change without notice.