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MLF2012A1R0XT PDF预览

MLF2012A1R0XT

更新时间: 2024-09-08 22:24:51
品牌 Logo 应用领域
东电化 - TDK /
页数 文件大小 规格书
3页 97K
描述
SMD

MLF2012A1R0XT 数据手册

 浏览型号MLF2012A1R0XT的Datasheet PDF文件第2页浏览型号MLF2012A1R0XT的Datasheet PDF文件第3页 
MLF Series MLF2012 Type  
Inductors  
For General Applications  
SMD  
FEATURES  
PRODUCT IDENTIFICATION  
• High-reliability monolithic structure.  
• Ferrite core and magnetic shielding enables the design of com-  
pact circuits with high packing density.  
• Excellent solderability and high heat resistance permits either  
flow or reflow soldering.  
MLF 1608  
A
1R0 K  
T
(1) (2) (3) (4) (5) (6)  
(1) Series name  
(2) Dimensions L×W  
1608  
2012  
1.6×0.8mm  
2.0×1.25mm  
APPLICATIONS  
Personal computers, HDDs, or other various electronic appliances.  
(3) Material code  
SPECIFICATIONS  
Operating temperature range  
Storage temperature range  
–25 to +85°C  
(4) Inductance value  
–40 to +85°C[Unit of products]  
47N  
R15  
1R0  
100  
47nH[0.047µH]  
0.15µH  
1µH  
RECOMMENDED REFLOW SOLDERING CONDITIONS  
10µH  
10s max.  
220°C  
200°C  
(5) Inductance tolerance  
Natural  
cooling  
K
±10%  
±20%  
M
150°C  
(6) Packaging style  
T
Preheating 60 to 120s min. 40s max.  
Taping [reel]  
PACKAGING STYLE AND QUANTITIES  
Packaging style  
Taping  
Product’s thickness  
0.8/0.85mm  
1.25mm  
( )  
Time s  
Quantity  
4000 pieces/reel  
2000 pieces/reel  
HANDLING AND PRECAUTIONS  
• Before soldering, be sure to preheat components.  
The preheating temperature should be set so that the tempera-  
ture difference between the solder temperature and product  
temperature does not exceed 150°C.  
• After mounting components onto the printed circuit board, do not  
apply stress through board bending or mishandling.  
• The inductance value may change due to magnetic saturation if  
the current exceeds the rated maximum.  
• Do not expose the inductors to stray magnetic fields.  
• Avoid static electricity discharge during handling.  
• When hand soldering, apply the soldering iron to the printed cir-  
cuit board only. Temperature of the iron tip should not exceed  
300°C. Soldering time should not exceed 3 seconds.  
Specifications which provide more details for the proper and safe use of the described product are available upon request.  
All specifications are subject to change without notice.  

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