F-219 (Rev 12MAY20)
MLE–120–01–G–DV
MLE–150–01–G–DV
10 YEAR MFG
WITH 30 µ" GOLD
EXTENDED LIFE
CLM–126–02–F–D
PRODUCT
HIGH MATING
CYCLES
CLM–111–02–L–D
(1.00 mm) .0394"
CLM, MLE SERIES
RUGGED RELIABLE MICRO SOCKETS
SPECIFICATIONS
PLATING
OPTION
NO. PINS
PER ROW
OPTIONS
CLM
02
D
1
For complete specifications and
recommended PCB layouts
see www.samtec.com?CLM
or www.samtec.com?MLE
Mates with:
FTM, FTMH, MW
Insulator Material:
Black LCP
–F
= Gold flash on
contact,
–BE
Contact Material:
CLM: Phosphor Bronze
MLE: BeCu
02 thru 50
= Bottom Entry
Matte Tin on tail
(Required for bottom entry)
Plating:
CLM: Au or Sn
–L
–K
over 50 µ" (1.27 µm) Ni
MLE: Au over 10 µ"
(0.25 µm) Ni
= 10 µ" (0.25 µm)
Gold on contact,
Matte Tin on tail
= (3.50 mm) .138" DIA
Polyimide film Pick & Place Pad
(7 positions minimum)
(5.72)
.225
x
(3.57)
.140
Current Rating (CLM/FTM):
2.8 A per pin
(2 pins powered)
No. of positions x (1.00) .03937
+ (0.318) .0125
–P
Current Rating (MLE/FTM):
2.9 A per pin
(1.00)
PIN/ROW
04-15
A
02
01
.03937 100
= Pick & Place Pad
(7 positions minimum)
(3.56)
.140
(2.41)
.095
(2 pins powered)
(2.54)
.100
Operating Temp Range:
-55 °C to +125 °C
(7.11)
.280
16-50
–P
Max Cycles:
–PA
CLM: 100 with 10 µ" (0.25 µm) Au
Voltage Rating:
(0.28)
.011
(1.00)
.03937
= Pick & Place Pad with
integral Alignment Pin
(8.26) .325
by A
(3.81)
.150
MLE: 310 VAC
Insertion Depth:
(1.36)
.054
(3.00)
.118
(2.26)
.089
(2.12)
.084
CLM: Top Entry = (1.40 mm)
.055" min., Bottom Entry =
(2.41 mm) .095" min.
(Add board thickness for
correct post OAL)
–TR
= Tape & Reel Packaging
(0.89) .035
DIA
(7.00)
.275
–PA
–FR
APPLICATION
MLE: (1.63 mm) .064" to
(3.18 mm) .125" with
(0.38 mm) .015" wipe,
pass-through, or
(2.44 mm) .096" minimum
for bottom entry
Normal Force:
CLM: 40 grams (0.39 N) average
RoHS Compliant:
Yes
Lead-Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (02-25)
(0.15 mm) .006" max (26-50)*
*(.004" stencil solution
may be available; contact
IPG@samtec.com)
= Full Reel Tape & Reel
(must order max. quantity per
reel; contact Samtec for
quantity breaks)
ALSO AVAILABLE
(MOQ Required)
• Alignment pin
• Other Gold plating options
Pass-Thru
PLATING
OPTION
NO. PINS
PER ROW
OPTIONS
MLE
01
DV
1
Mates with:
FTM, FTMH, MW
–G
RECOGNITIONS
= 10 µ"
(0.25 µm)
Gold
–A
02 thru 50
For complete scope of
recognitions see
www.samtec.com/quality
= Alignment Pin
(3 positions minimum)
Metal or plastic at Samtec
discretion
(0.71)
.028
No. of positions
FILE NO. E111594
(1.00)
.03937
x (1.00) .03937 + (0.20) .008
100
02
01
–K
(0.64)
.025
DIA
= (4.00 mm) .1575" DIA
Polyimide film Pick & Place Pad
(5 positions minimum)
(3.07)
.121
–A
(6.35)
.250
x
(3.18)
.125
(0.30)
.012
(1.00)
.03937
–P
= Metal Pick & Place Pad
(5 positions minimum)
(4.32)
.170
(3.30)
.130
(3.50)
.138
–TR
(3.12)
.123
Note:
= Tape & Reel Packaging
Some lengths, styles and
options are non-standard,
non-returnable.
–P
Due to technical progress, all designs, specifications and components are subject to change without notice.
WWW.SAMTEC.COM
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.